{"id":10422,"date":"2026-07-19T13:48:30","date_gmt":"2026-07-19T13:48:30","guid":{"rendered":"https:\/\/ic-vendor.com\/43650-0516\/"},"modified":"2026-07-19T13:48:30","modified_gmt":"2026-07-19T13:48:30","slug":"43650-0516","status":"publish","type":"post","link":"https:\/\/ic-vendor.com\/es\/43650-0516\/","title":{"rendered":"43650-0516"},"content":{"rendered":"<h2>Productos<\/h2>\n<p>The 43650-0516 is a 5-circuit vertical through-hole PCB header from Molex&#8217;s Micro-Fit 3.0 series. This single-row, 3.0mm pitch connector features gold-plated brass contacts with PCB polarizing pegs and kinked solder legs for secure board retention. Designed for wire-to-board power applications, it delivers up to 8.5A per contact in a compact footprint.<\/p>\n<h2>Especificaciones<\/h2>\n<table>\n<tr>\n<td>Series<\/td>\n<td>Micro-Fit 3.0 (43650)<\/td>\n<\/tr>\n<tr>\n<td>Number of Contacts<\/td>\n<td>5<\/td>\n<\/tr>\n<tr>\n<td>Pitch<\/td>\n<td>3.0 mm<\/td>\n<\/tr>\n<tr>\n<td>Number of Rows<\/td>\n<td>1<\/td>\n<\/tr>\n<tr>\n<td>Orientation<\/td>\n<td>Vertical (Straight)<\/td>\n<\/tr>\n<tr>\n<td>Current Rating<\/td>\n<td>8.5A per contact (max)<\/td>\n<\/tr>\n<tr>\n<td>Voltage Rating<\/td>\n<td>600V (max)<\/td>\n<\/tr>\n<tr>\n<td>Contact Material<\/td>\n<td>Brass<\/td>\n<\/tr>\n<tr>\n<td>Contact Plating<\/td>\n<td>Gold (0.38\/1.27 \u03bcm)<\/td>\n<\/tr>\n<tr>\n<td>Housing Material<\/td>\n<td>High Temperature Thermoplastic LCP<\/td>\n<\/tr>\n<tr>\n<td>Temperatura de funcionamiento<\/td>\n<td>-40\u00b0C to +105\u00b0C<\/td>\n<\/tr>\n<tr>\n<td>Mounting<\/td>\n<td>Through Hole (with PCB Pegs)<\/td>\n<\/tr>\n<tr>\n<td>Termination<\/td>\n<td>Solder<\/td>\n<\/tr>\n<tr>\n<td>Tail Length<\/td>\n<td>3.18 mm<\/td>\n<\/tr>\n<\/table>\n<h2>Caracter\u00edsticas<\/h2>\n<ul>\n<li>3.0mm pitch provides high current density in a small footprint<\/li>\n<li>Gold contact plating for superior conductivity and corrosion resistance<\/li>\n<li>Positive locking ramp prevents accidental disconnection<\/li>\n<li>PCB polarizing pegs for alignment and positioning<\/li>\n<li>Kinked solder legs for additional PCB retention during processing<\/li>\n<li>High-temperature LCP housing withstands IR reflow up to 265\u00b0C<\/li>\n<li>Fully isolated dual-beam terminals reduce arcing potential<\/li>\n<\/ul>\n<h2>Aplicaciones<\/h2>\n<ul>\n<li>Consumer appliances (dryers, freezers, refrigerators, washers)<\/li>\n<li>Data communications (routers, servers)<\/li>\n<li>Medical equipment<\/li>\n<li>Telecommunications infrastructure<\/li>\n<li>Military COTS (Commercial Off-The-Shelf) systems<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"<p>Product Overview The 43650-0516 is a 5-circuit vertical through-hole PCB header from Molex&#8217;s Micro-Fit 3.0 series. This single-row, 3.0mm pitch connector features gold-plated brass contacts with PCB polarizing pegs and kinked solder legs for secure board retention. Designed for wire-to-board power applications, it delivers up to 8.5A per contact in a compact footprint. Key Specifications [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[13,20],"tags":[1726],"chip_brand":[256],"class_list":["post-10422","post","type-post","status-publish","format-standard","hentry","category-integrated-circuits-ics","category-interface-ics","tag-43650-0516","chip_brand-molex"],"acf":{"brief_explanation":"Molex Micro-Fit 3.0 header, 5 circuits, 3.0mm pitch, single row, vertical, gold, through hole","date_code":"","package_case":"Through Hole, Vertical, 3.0mm pitch (18.65 \u00d7 5.57 \u00d7 9.9 mm)","in_stock":6487,"datasheet":"https:\/\/www.molex.com\/en-us\/products\/connectors\/power-connectors\/micro-fit-3","price":"$0.91 @ 250pcs","product_introduction":"The Molex 43650-0516 is a 5-circuit single-row vertical PCB header from the Micro-Fit 3.0 connector system. Designed for wire-to-board power distribution, it provides up to 8.5A per contact with a 600V voltage rating. The gold-plated brass contacts ensure reliable performance in demanding environments, while the high-temperature LCP housing accommodates lead-free IR reflow soldering processes. PCB polarizing pegs and kinked solder legs ensure precise board alignment and secure retention during wave soldering.","working_principle":"The Micro-Fit 3.0 header uses a positive locking ramp mechanism integrated into the housing that engages with the mating receptacle to prevent accidental disconnection. The fully isolated dual-beam terminals provide four points of contact per mating interface for redundancy and reliable electrical performance. The brass contacts with selective gold plating over nickel underplating minimize contact resistance while providing excellent wear and corrosion resistance. The LCP housing's high-temperature tolerance allows the connector to withstand IR reflow soldering processes up to 265\u00b0C without deformation.","pin_description":"<table><tr><th>Pin<\/th><th>Name<\/th><th>Type<\/th><th>Function<\/th><\/tr><tr><td>1<\/td><td>Contact 1<\/td><td>Power\/Signal<\/td><td>Circuit 1 \u2014 power or signal<\/td><\/tr><tr><td>2<\/td><td>Contact 2<\/td><td>Power\/Signal<\/td><td>Circuit 2 \u2014 power or signal<\/td><\/tr><tr><td>3<\/td><td>Contact 3<\/td><td>Power\/Signal<\/td><td>Circuit 3 \u2014 power or signal<\/td><\/tr><tr><td>4<\/td><td>Contact 4<\/td><td>Power\/Signal<\/td><td>Circuit 4 \u2014 power or signal<\/td><\/tr><tr><td>5<\/td><td>Contact 5<\/td><td>Power\/Signal<\/td><td>Circuit 5 \u2014 power or signal<\/td><\/tr><tr><td>\u2014<\/td><td>PCB Pegs<\/td><td>Mechanical<\/td><td>Polarization and board alignment<\/td><\/tr><\/table>","application_scenarios":"<ul><li>Power distribution in consumer appliance motor control boards<\/li><li>Server rack wire-to-board power connections<\/li><li>Medical device power supply interconnects<\/li><li>Telecom base station power distribution<\/td><\/li><li>Solar power inverter internal wiring<\/li><\/ul>","alternative_models":"<table><tr><th>Manufacturer<\/th><th>Part Number<\/th><th>Package<\/th><th>Notes<\/th><\/tr><tr><td>Molex<\/td><td>43650-0515<\/td><td>3.0mm, TH<\/td><td>Tin-plated variant<\/td><\/tr><tr><td>Molex<\/td><td>43650-0517<\/td><td>3.0mm, TH<\/td><td>30\u03bc gold plating variant<\/td><\/tr><tr><td>TE Connectivity<\/td><td>1-770967-5<\/td><td>3.0mm, TH<\/td><td>Comparable power header<\/td><\/tr><tr><td>JST<\/td><td>B05P-VH<\/td><td>3.96mm<\/td><td>Wider pitch alternative<\/td><\/tr><\/table>"},"_links":{"self":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/posts\/10422","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/comments?post=10422"}],"version-history":[{"count":0,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/posts\/10422\/revisions"}],"wp:attachment":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/media?parent=10422"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/categories?post=10422"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/tags?post=10422"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/chip_brand?post=10422"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}