{"id":12331,"date":"2026-07-28T03:24:21","date_gmt":"2026-07-28T03:24:21","guid":{"rendered":"https:\/\/ic-vendor.com\/k4a8g165wg-bcwe\/"},"modified":"2026-07-28T03:24:21","modified_gmt":"2026-07-28T03:24:21","slug":"k4a8g165wg-bcwe","status":"publish","type":"post","link":"https:\/\/ic-vendor.com\/es\/k4a8g165wg-bcwe\/","title":{"rendered":"K4A8G165WG-BCWE"},"content":{"rendered":"<h2>Productos<\/h2>\n<p>The K4A8G165WG-BCWE is a 8Gbit (512M x 16) DDR4 SDRAM from Samsung operating at 1.2V with up to 3200 MT\/s data rate. It uses 8-bit burst length, BL8\/BC4 on-the-fly, and supports bank group architecture (4 bank groups x 4 banks). The BCWE speed bin supports CL22 timing at 3200 MT\/s.<\/p>\n<h2>Especificaciones<\/h2>\n<table>\n<tr>\n<td>Densidad<\/td>\n<td>8Gbit (512M x 16)<\/td>\n<\/tr>\n<tr>\n<td>Standard<\/td>\n<td>DDR4 SDRAM<\/td>\n<\/tr>\n<tr>\n<td>Velocidad de datos<\/td>\n<td>Up to 3200 MT\/s<\/td>\n<\/tr>\n<tr>\n<td>Tensi\u00f3n de alimentaci\u00f3n<\/td>\n<td>1.2V (VDD), 1.2V (VDDQ)<\/td>\n<\/tr>\n<tr>\n<td>Burst Length<\/td>\n<td>8 (BL8) \/ 4 (BC4) on-the-fly<\/td>\n<\/tr>\n<tr>\n<td>Bank Groups<\/td>\n<td>4 x 4 = 16 banks<\/td>\n<\/tr>\n<tr>\n<td>Latencia CAS<\/td>\n<td>CL22 @ 3200 MT\/s<\/td>\n<\/tr>\n<tr>\n<td>Temperatura de funcionamiento<\/td>\n<td>0\u00b0C to +95\u00b0C (normal)<\/td>\n<\/tr>\n<tr>\n<td>Paquete<\/td>\n<td>FBGA (78-ball)<\/td>\n<\/tr>\n<tr>\n<td>Estado de las piezas<\/td>\n<td>Activo<\/td>\n<\/tr>\n<\/table>\n<h2>Caracter\u00edsticas<\/h2>\n<ul>\n<li>8Gbit DDR4 SDRAM with x16 organization<\/li>\n<li>Data rate up to 3200 MT\/s (DDR4-3200)<\/li>\n<li>1.2V VDD\/VDDQ operation<\/li>\n<li>4 bank groups with 16 total banks<\/li>\n<li>BL8\/BC4 on-the-fly burst length<\/li>\n<li>Write leveling, read DBI, and CA training<\/li>\n<li>On-die termination (ODT)<\/li>\n<li>Internal VREFDQ training<\/li>\n<\/ul>\n<h2>Aplicaciones<\/h2>\n<ul>\n<li>DDR4 memory modules (SO-DIMM, RDIMM)<\/li>\n<li>Embedded computing and networking<\/li>\n<li>Graphics and video processing<\/li>\n<li>AI\/ML inference accelerators<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"<p>Product Overview The K4A8G165WG-BCWE is a 8Gbit (512M x 16) DDR4 SDRAM from Samsung operating at 1.2V with up to 3200 MT\/s data rate. It uses 8-bit burst length, BL8\/BC4 on-the-fly, and supports bank group architecture (4 bank groups x 4 banks). The BCWE speed bin supports CL22 timing at 3200 MT\/s. Key Specifications Density [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[19,13],"tags":[3325],"chip_brand":[162],"class_list":["post-12331","post","type-post","status-publish","format-standard","hentry","category-analog-linear-ics","category-integrated-circuits-ics","tag-k4a8g165wg-bcwe","chip_brand-samsung"],"acf":{"brief_explanation":"8Gb DDR4-3200 SDRAM, 512Mx16, 1.2V, CL22, 4-bank-group, FBGA-78","date_code":"","package_case":"FBGA-78","in_stock":3245,"datasheet":"https:\/\/www.samsung.com\/semiconductor\/dram\/ddr4\/","price":"","product_introduction":"The K4A8G165WG-BCWE is an 8Gbit DDR4 SDRAM from Samsung organized as 512M x 16 bits, operating at 1.2V with data rates up to 3200 MT\/s (DDR4-3200). It features 4 bank groups with 16 total banks, BL8\/BC4 on-the-fly burst length, and CL22 timing at 3200 MT\/s. The x16 bus width makes it suitable for high-bandwidth memory subsystems in embedded computing and networking applications.","working_principle":"The K4A8G165WG operates as a DDR4 SDRAM following the JEDEC JESD79-4 standard. Commands are clocked on the rising edge of the clock. Data is transferred on both rising and falling edges of the DQS strobe (double data rate). Read: Activate row, then Read with column address \u2014 data appears after CL clock cycles. Write: Activate row, then Write with data. Precharge and refresh operations maintain data integrity. Bank group architecture enables pipelined operations across groups for higher bandwidth.","pin_description":"<table><tr><th>Pin Group<\/th><th>Interface<\/th><th>Function<\/th><\/tr><tr><td>A0-A17, BA0-BA1, BG0-BG1<\/td><td>Input<\/td><td>Address, bank, bank group<\/td><\/tr><tr><td>DQ0-DQ15<\/td><td>I\/O<\/td><td>16-bit data bus<\/td><\/tr><tr><td>UDQS#, UDQS, LDQS#, LDQS<\/td><td>I\/O<\/td><td>Upper\/lower data strobes<\/td><\/tr><tr><td>DM#, DBI#<\/td><td>I\/O<\/td><td>Data mask \/ Data bus inversion<\/td><\/tr><tr><td>CK, CK#, CKE, CS#, ACT#<\/td><td>Input<\/td><td>Clock, enable, chip select, activate<\/td><\/tr><tr><td>RAS#, CAS#, WE#<\/td><td>Input<\/td><td>Command inputs<\/td><\/tr><tr><td>ODT<\/td><td>Input<\/td><td>On-die termination control<\/td><\/tr><\/table>","application_scenarios":"<ul><li>DDR4 SO-DIMM memory modules for laptops<\/li><li>Embedded networking and computing SRAM<\/li><li>AI inference accelerator memory<\/li><\/ul>","alternative_models":"<table><tr><th>Manufacturer<\/th><th>Part Number<\/th><th>Package<\/th><th>Notes<\/th><\/tr><tr><td>Micron<\/td><td>MT40A8G16TW-16E<\/td><td>FBGA<\/td><td>8Gb DDR4 x16 alternative<\/td><\/tr><tr><td>SK Hynix<\/td><td>H5AN8G6NDJR-VNC<\/td><td>FBGA<\/td><td>8Gb DDR4 x16 alternative<\/td><\/tr><\/table>"},"_links":{"self":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/posts\/12331","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/comments?post=12331"}],"version-history":[{"count":0,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/posts\/12331\/revisions"}],"wp:attachment":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/media?parent=12331"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/categories?post=12331"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/tags?post=12331"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/chip_brand?post=12331"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}