{"id":9567,"date":"2026-07-04T03:50:02","date_gmt":"2026-07-04T03:50:02","guid":{"rendered":"https:\/\/ic-vendor.com\/te32ghsxv3mh-v\/"},"modified":"2026-07-04T03:50:02","modified_gmt":"2026-07-04T03:50:02","slug":"te32ghsxv3mh-v","status":"publish","type":"post","link":"https:\/\/ic-vendor.com\/es\/te32ghsxv3mh-v\/","title":{"rendered":"TE32GHSXV3MH-V"},"content":{"rendered":"

Productos<\/h2>\n

The TE32GHSXV3MH-V is a Samsung DDR5 SDRAM module offering 32 GB capacity at 5600 Mbps data rate with 1.1V operation. Designed for high-performance computing, workstations, and server platforms, it leverages Samsung’s advanced DRAM process technology with on-die ECC for enhanced data integrity.<\/p>\n

Especificaciones<\/h2>\n\n\n\n\n\n\n\n\n\n\n
Tipo<\/td>\nDDR5 SDRAM Module<\/td>\n<\/tr>\n
Densidad<\/td>\n32 GB<\/td>\n<\/tr>\n
Speed<\/td>\n5600 Mbps (PC5-44800)<\/td>\n<\/tr>\n
Tensi\u00f3n<\/td>\n1.1 V<\/td>\n<\/tr>\n
Organization<\/td>\n2R x 8 (dual-rank)<\/td>\n<\/tr>\n
ECC<\/td>\nOn-die ECC (ODECC)<\/td>\n<\/tr>\n
Module Type<\/td>\nUDIMM \/ RDIMM<\/td>\n<\/tr>\n
N\u00famero de agujas<\/td>\n288-pin (UDIMM) \/ 262-pin (SODIMM)<\/td>\n<\/tr>\n
Temperatura de funcionamiento<\/td>\n0\u00b0C to 85\u00b0C (commercial)<\/td>\n<\/tr>\n<\/table>\n

Caracter\u00edsticas<\/h2>\n
    \n
  • DDR5 architecture with dual 32-bit sub-channels for doubled bandwidth efficiency<\/li>\n
  • 5600 Mbps data rate with XMP 3.0 support for overclocking<\/li>\n
  • On-die ECC (ODECC) for improved reliability and data integrity<\/li>\n
  • 1.1V low-voltage operation with on-DIMM PMIC for efficient power regulation<\/li>\n
  • 32 GB density enabling large memory configurations for demanding workloads<\/li>\n<\/ul>\n

    Aplicaciones<\/h2>\n
      \n
    • High-performance gaming and enthusiast desktop PCs<\/li>\n
    • Content creation workstations (video editing, 3D rendering)<\/li>\n
    • Data analytics and machine learning development<\/li>\n
    • Virtualization hosts running multiple VMs<\/li>\n
    • Embedded computing platforms requiring high memory density<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

      Product Overview The TE32GHSXV3MH-V is a Samsung DDR5 SDRAM module offering 32 GB capacity at 5600 Mbps data rate with 1.1V operation. Designed for high-performance computing, workstations, and server platforms, it leverages Samsung’s advanced DRAM process technology with on-die ECC for enhanced data integrity. Key Specifications Type DDR5 SDRAM Module Density 32 GB Speed 5600 […]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[39,13],"tags":[810],"chip_brand":[162],"class_list":["post-9567","post","type-post","status-publish","format-standard","hentry","category-flash-memory-nand-nor-flash","category-integrated-circuits-ics","tag-te32ghsxv3mh-v","chip_brand-samsung"],"acf":{"brief_explanation":"Samsung 32 GB DDR5 5600 Mbps SDRAM module with on-die ECC, 1.1V, dual-rank x8 for high-performance computing","date_code":"","package_case":"288-pin UDIMM \/ 262-pin SODIMM","in_stock":11118,"datasheet":"https:\/\/semiconductor.samsung.com\/dram\/ddr\/ddr5\/","price":"","product_introduction":"The TE32GHSXV3MH-V is a Samsung DDR5 SDRAM memory module providing 32 GB capacity at 5600 Mbps data rate in a 1.1V design. Built on Samsung's advanced DRAM process with on-die ECC for self-correcting single-bit errors, it delivers reliable high-bandwidth memory for gaming, content creation, and professional workloads. The DDR5 architecture features dual 32-bit sub-channels and on-DIMM PMIC for improved power regulation and signal integrity.","working_principle":"The TE32GHSXV3MH-V DDR5 module operates with two independent 32-bit sub-channels (vs. single 64-bit in DDR4), enabling more efficient concurrent data access. On-die ECC (ODECC) automatically corrects single-bit errors within each DRAM chip, improving reliability without host overhead. The on-DIMM Power Management IC (PMIC) converts 5V input to the 1.1V Vdd supply locally, reducing power delivery noise and improving signal integrity. Command\/address signals use a dedicated register clock driver (RCD in RDIMM) to maintain signal quality at 5600 Mbps rates.","pin_description":"
      Pin Group<\/th>Function<\/th><\/tr>
      DQ [63:0]<\/td>64-bit data bus (dual 32-bit sub-channels)<\/td><\/tr>
      CB [7:0]<\/td>ECC check bits<\/td><\/tr>
      CA<\/td>Command\/address bus<\/td><\/tr>
      CK\/CKn<\/td>Differential clock<\/td><\/tr>
      CS\/CA<\/td>Chip select and command\/address<\/td><\/tr>
      DQS\/DQSn<\/td>Data strobe differential pairs<\/td><\/tr>
      VDD<\/td>1.1V core supply (via PMIC)<\/td><\/tr>
      VPP<\/td>2.5V wordline boost supply<\/td><\/tr><\/table>","application_scenarios":"
      • High-end gaming desktop with 64 GB (2x32GB) DDR5-5600 for 4K gaming<\/li>
      • Video editing workstation with 128 GB (4x32GB) for 8K timeline scrubbing<\/li>
      • Machine learning development system with large model memory footprint<\/li>
      • Virtualization host running 10+ concurrent VMs with 128 GB allocation<\/li>
      • Embedded edge computing platform with high-density memory requirements<\/li><\/ul>","alternative_models":"
        Model<\/th>Manufacturer<\/th>Key Difference<\/th><\/tr>
        M425R4GA3PB0-CWM<\/td>Samsung<\/td>DDR5 32GB SODIMM 5600Mbps<\/td><\/tr>
        CT32G48C40U5<\/td>Crucial<\/td>32GB DDR5-4800 UDIMM<\/td><\/tr>
        F5-5600J4040A32G<\/td>G.Skill<\/td>32GB DDR5-5600 with XMP 3.0<\/td><\/tr>
        KF556C40BBK2-64<\/td>Kingston<\/td>64GB kit DDR5-5600<\/td><\/tr>
        HMAA2GL7AMR4N-XN<\/td>SK Hynix<\/td>32GB DDR5-4800 RDIMM<\/td><\/tr><\/table>"},"_links":{"self":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/posts\/9567","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/comments?post=9567"}],"version-history":[{"count":0,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/posts\/9567\/revisions"}],"wp:attachment":[{"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/media?parent=9567"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/categories?post=9567"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/tags?post=9567"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/ic-vendor.com\/es\/wp-json\/wp\/v2\/chip_brand?post=9567"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}