{"id":11002,"date":"2026-07-21T13:56:32","date_gmt":"2026-07-21T13:56:32","guid":{"rendered":"https:\/\/ic-vendor.com\/c2012x7r105kep\/"},"modified":"2026-07-21T13:56:32","modified_gmt":"2026-07-21T13:56:32","slug":"c2012x7r105kep","status":"publish","type":"post","link":"https:\/\/ic-vendor.com\/zh\/c2012x7r105kep\/","title":{"rendered":"C2012X7R105KEP"},"content":{"rendered":"

\u4ea7\u54c1\u6982\u89c8<\/h2>\n

The C2012X7R105KEP from TDK is a 1\u00b5F 25V MLCC in an 0805 (2012 metric) package with X7R dielectric and \u00b110% tolerance, featuring soft (flexible) termination. The EP suffix indicates TDK’s commercial-grade soft termination C series, which incorporates a conductive resin layer in the terminal electrodes to prevent ceramic cracking from PCB bending and thermal shock.<\/p>\n

\u4e3b\u8981\u89c4\u683c<\/h2>\n\n\n\n\n\n\n\n\n\n
Capacitance<\/td>\n1\u00b5F<\/td>\n<\/tr>\n
Rated Voltage<\/td>\n25V DC (2A code)<\/td>\n<\/tr>\n
Tolerance<\/td>\n\u00b110% (K)<\/td>\n<\/tr>\n
Dielectric<\/td>\nX7R (EIA Class II)<\/td>\n<\/tr>\n
\u5305\u88c5<\/td>\n0805 (2012 Metric) – 2.0 \u00d7 1.25 \u00d7 1.25mm<\/td>\n<\/tr>\n
\u5de5\u4f5c\u6e29\u5ea6<\/td>\n-55\u00b0C to +125\u00b0C<\/td>\n<\/tr>\n
Termination<\/td>\nSoft (conductive resin layer)<\/td>\n<\/tr>\n
Dissipation Factor<\/td>\n\u22643% @ 1kHz<\/td>\n<\/tr>\n<\/table>\n

\u7279\u70b9<\/h2>\n
    \n
  • Soft termination prevents ceramic cracking from board flexure and thermal shock<\/li>\n
  • 1\u00b5F at 25V for 12V\/5V power rail decoupling<\/li>\n
  • X7R dielectric with \u00b115% temperature stability to 125\u00b0C<\/li>\n
  • 4-layer terminal structure: Cu \/ conductive resin \/ Ni \/ Sn<\/li>\n
  • Fail-safe design for power line applications<\/li>\n<\/ul>\n

    \u5e94\u7528<\/h2>\n
      \n
    • Mobile device power line decoupling with drop protection<\/li>\n
    • Automotive ECU bypass capacitor requiring flexure resistance<\/li>\n
    • Power supply output filtering in vibration-prone environments<\/li>\n
    • Board-level power rail decoupling near connectors<\/li>\n
    • Industrial equipment power supply bypass<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

      Product Overview The C2012X7R105KEP from TDK is a 1\u00b5F 25V MLCC in an 0805 (2012 metric) package with X7R dielectric and \u00b110% tolerance, featuring soft (flexible) termination. The EP suffix indicates TDK’s commercial-grade soft termination C series, which incorporates a conductive resin layer in the terminal electrodes to prevent ceramic cracking from PCB bending and […]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[19,13],"tags":[2328],"chip_brand":[205],"class_list":["post-11002","post","type-post","status-publish","format-standard","hentry","category-analog-linear-ics","category-integrated-circuits-ics","tag-c2012x7r105kep","chip_brand-tdk"],"acf":{"brief_explanation":"1\u00b5F 25V X7R MLCC, 0805, \u00b110%, soft termination (EP), flexure-resistant","date_code":"","package_case":"0805 (2012 Metric) - 2.0 \u00d7 1.25 \u00d7 1.25mm","in_stock":5700,"datasheet":"https:\/\/product.tdk.com\/en\/search\/capacitor\/ceramic\/mlcc\/info?part_no=C2012X7R105KEP","price":"$0.015 @ 1ku","product_introduction":"The C2012X7R105KEP from TDK is a 1\u00b5F \u00b110% MLCC in an 0805 (2012 metric) package with X7R dielectric, rated at 25V DC. The TDK part numbering: C=MLCC, 2012=size (0805), X7R=dielectric, 105=1\u00b5F (10\u00d710\u2075pF), K=\u00b110%, E=soft termination, P=packaging. The EP suffix denotes TDK's commercial-grade soft termination C series, which incorporates a conductive resin layer between the Cu base and Ni\/Sn plating of the terminal electrodes. This 4-layer structure (Cu\/conductive resin\/Ni\/Sn) absorbs mechanical stress from PCB bending and thermal shock, preventing the ceramic body from cracking \u2014 a common failure mode in applications subject to vibration, drop impact, or thermal cycling. The soft termination is particularly important in mobile devices, automotive ECUs, and other environments with mechanical stress.","working_principle":"The C2012X7R105KEP uses TDK's multilayer ceramic construction with X7R dielectric and a unique soft termination structure. The standard MLCC terminal has a 3-layer structure (Cu\/Ni\/Sn), but the soft termination version adds a conductive resin layer between the Cu and Ni layers, creating a 4-layer structure (Cu\/conductive resin\/Ni\/Sn). The conductive resin layer is elastic and absorbs mechanical stress that would otherwise be transmitted to the ceramic body, causing cracks. When the PCB bends or experiences thermal shock, the resin layer deforms instead of transmitting the stress to the rigid ceramic. This prevents the two most common MLCC failure modes: flex cracks (from PCB bending) and thermal cracks (from solder joint thermal stress). The X7R dielectric provides \u00b115% capacitance change over the -55\u00b0C to +125\u00b0C range.","pin_description":"\n
      Pin<\/th>Name<\/th>Type<\/th>Function<\/th><\/tr>\n
      1<\/td>Terminal 1<\/td>Passive<\/td>One electrode (soft termination)<\/td><\/tr>\n
      2<\/td>Terminal 2<\/td>Passive<\/td>Other electrode (soft termination)<\/td><\/tr>\n<\/table>","application_scenarios":"
        \n
      • Smartphone 5V VBUS power line 1\u00b5F decoupling with drop protection<\/li>\n
      • Automotive ECU 12V battery line 1\u00b5F bypass capacitor with flexure resistance<\/li>\n
      • Industrial motor controller power rail 1\u00b5F filter in vibration environment<\/li>\n
      • Laptop motherboard 5V rail 1\u00b5F decoupling near connector with thermal cycling<\/li>\n
      • Tablet device 3.3V rail 1\u00b5F bypass capacitor with board flex protection<\/li>\n<\/ul>","alternative_models":"\n
        Manufacturer<\/th>Part Number<\/th>Package<\/th>Notes<\/th><\/tr>\n
        Murata<\/td>GRM21BR71E105KA60L<\/td>0805<\/td>1\u00b5F 25V X7R \u00b110%<\/td><\/tr>\n
        TDK<\/td>C2012X7R1E105K125AB<\/td>0805<\/td>1\u00b5F 25V X7R standard termination<\/td><\/tr>\n
        YAGEO<\/td>CC0805KKX7R8BB105<\/td>0805<\/td>1\u00b5F 25V X7R \u00b110%<\/td><\/tr>\n
        Samsung<\/td>CL21B105KAFNNNE<\/td>0805<\/td>1\u00b5F 25V X7R \u00b110%<\/td><\/tr>\n
        KEMET<\/td>C0805C105K3RAC7210<\/td>0805<\/td>1\u00b5F 25V X7R \u00b110% flex<\/td><\/tr>\n<\/table>"},"_links":{"self":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/posts\/11002","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/comments?post=11002"}],"version-history":[{"count":0,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/posts\/11002\/revisions"}],"wp:attachment":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/media?parent=11002"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/categories?post=11002"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/tags?post=11002"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/chip_brand?post=11002"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}