{"id":11580,"date":"2026-07-26T12:50:22","date_gmt":"2026-07-26T12:50:22","guid":{"rendered":"https:\/\/ic-vendor.com\/10m02sce144i7g\/"},"modified":"2026-07-26T12:50:22","modified_gmt":"2026-07-26T12:50:22","slug":"10m02sce144i7g","status":"publish","type":"post","link":"https:\/\/ic-vendor.com\/zh\/10m02sce144i7g\/","title":{"rendered":"10M02SCE144I7G"},"content":{"rendered":"

\u4ea7\u54c1\u6982\u89c8<\/h2>\n

The 10M02SCE144I7G is an Intel MAX 10 FPGA with 2,000 logic elements and 108 Kbits of embedded memory. Single-supply 3.3V operation with integrated flash for instant-on configuration. 1 PLL. EQFP-144 industrial grade package. Cost-effective for glue logic, I\/O expansion, and protocol bridging.<\/p>\n

\u4e3b\u8981\u89c4\u683c<\/h2>\n\n\n\n\n\n\n\n\n\n\n\n
\u7c7b\u578b<\/td>\nMAX 10 FPGA<\/td>\n<\/tr>\n
Logic Elements<\/td>\n2,000<\/td>\n<\/tr>\n
Embedded Memory<\/td>\n108 Kbits M9K<\/td>\n<\/tr>\n
PLLs<\/td>\n1<\/td>\n<\/tr>\n
ADC<\/td>\nNot available (S variant)<\/td>\n<\/tr>\n
I\/O Pins<\/td>\n101<\/td>\n<\/tr>\n
\u7535\u6e90\u7535\u538b<\/td>\n3.3V I\/O, 1.2V core<\/td>\n<\/tr>\n
JTAG<\/td>\nYes<\/td>\n<\/tr>\n
Operating Temp<\/td>\n-40 to +100C (Industrial)<\/td>\n<\/tr>\n
\u5305\u88c5<\/td>\nEQFP-144<\/td>\n<\/tr>\n<\/table>\n

\u5de5\u4f5c\u539f\u7406<\/h2>\n

MAX 10 FPGAs integrate configuration flash memory, eliminating external configuration devices. The FPGA fabric consists of Logic Array Blocks (LABs) with 10 Adaptive Logic Modules (ALMs) each. ALMs contain fracturable LUTs and two registers. M9K memory blocks support single-port, dual-port, and FIFO modes. The integrated flash provides instant-on capability (no configuration latency). Dual-purpose I\/O pins support DDR3 memory interfaces at reduced rates.<\/p>\n

\u5e94\u7528<\/h2>\n
    \n
  • Glue logic<\/li>\n
  • I\/O expansion<\/li>\n
  • Protocol bridging<\/li>\n
  • Bus interfacing<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

    Product Overview The 10M02SCE144I7G is an Intel MAX 10 FPGA with 2,000 logic elements and 108 Kbits of embedded memory. Single-supply 3.3V operation with integrated flash for instant-on configuration. 1 PLL. EQFP-144 industrial grade package. Cost-effective for glue logic, I\/O expansion, and protocol bridging. Key Specifications Type MAX 10 FPGA Logic Elements 2,000 Embedded Memory […]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[13],"tags":[2849],"chip_brand":[196],"class_list":["post-11580","post","type-post","status-publish","format-standard","hentry","category-integrated-circuits-ics","tag-10m02sce144i7g","chip_brand-intel"],"acf":{"brief_explanation":"10M02SCE144I7G - FPGA (Max 10)","date_code":"","package_case":"EQFP-144 (16x16mm)","in_stock":9616,"datasheet":"https:\/\/www.intel.com\/content\/dam\/www\/programmable\/us\/en\/pdfs\/literature\/hb\/max-10\/m10_overview.pdf","price":"$8.50 @ 1ku","product_introduction":"The 10M02SCE144I7G is an Intel MAX 10 FPGA with 2,000 logic elements and 108 Kbits of embedded memory. Single-supply 3.3V operation with integrated flash for instant-on configuration. 1 PLL. EQFP-144 industrial grade package. Cost-effective for glue logic, I\/O expansion, and protocol bridging.","working_principle":"MAX 10 FPGAs integrate configuration flash memory, eliminating external configuration devices. The FPGA fabric consists of Logic Array Blocks (LABs) with 10 Adaptive Logic Modules (ALMs) each. ALMs contain fracturable LUTs and two registers. M9K memory blocks support single-port, dual-port, and FIFO modes. The integrated flash provides instant-on capability (no configuration latency). Dual-purpose I\/O pins support DDR3 memory interfaces at reduced rates.","pin_description":"
    Pin Group<\/th>Name<\/th>Desc<\/th><\/tr>
    I\/O<\/td>101 pins<\/td>User I\/O<\/td><\/tr>
    JTAG<\/td>TCK\/TDI\/TDO\/TMS<\/td>Config\/Debug<\/td><\/tr>
    CLK<\/td>CLK pins<\/td>Dedicated clock<\/td><\/tr><\/table>","application_scenarios":"
    • Glue logic<\/li>
    • I\/O expansion<\/li>
    • Protocol bridging<\/li>
    • Bus interfacing<\/li><\/ul>","alternative_models":"
      Model<\/th>Vendor<\/th>Diff<\/th><\/tr>
      10M04SCE144I7G<\/td>Intel<\/td>4K LEs<\/td><\/tr><\/table>"},"_links":{"self":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/posts\/11580","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/comments?post=11580"}],"version-history":[{"count":0,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/posts\/11580\/revisions"}],"wp:attachment":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/media?parent=11580"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/categories?post=11580"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/tags?post=11580"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/chip_brand?post=11580"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}