{"id":12381,"date":"2026-07-28T11:40:37","date_gmt":"2026-07-28T11:40:37","guid":{"rendered":"https:\/\/ic-vendor.com\/mx60uf8g18ac-xki\/"},"modified":"2026-07-29T08:50:24","modified_gmt":"2026-07-29T08:50:24","slug":"mx60uf8g18ac-xki","status":"publish","type":"post","link":"https:\/\/ic-vendor.com\/zh\/mx60uf8g18ac-xki\/","title":{"rendered":"MX60UF8G18AC-XKI"},"content":{"rendered":"

\u4ea7\u54c1\u6982\u89c8<\/h2>\n

The MX60UF8G18AC-XKI is a 1.8V, 8Gb SLC (Single-Level Cell) NAND Flash Memory device from Macronix (MXIC), belonging to the MX60UF 1.8V family. It is stacked from two 4Gb die, each organized with two planes of 2048 blocks. The device features a (2048+64)-byte page size, (128K+4K)-byte block size, ONFI 1.0 compliant interface, and supports Cache Read\/Cache Program and Two-Plane operations. The -XKI suffix denotes the 63-VFBGA (9mm × 11mm) package with industrial-grade temperature range (-40°C to +85°C). With a typical P\/E endurance of 100K cycles (with 4-bit ECC per 528 bytes), it is well-suited for embedded system code and data storage in mobile, M2M, and low-voltage applications.<\/p>\n

\u4e3b\u8981\u89c4\u683c<\/h2>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
\u5236\u9020\u5546<\/strong><\/td>\nMacronix (MXIC)<\/td>\n<\/tr>\n
Density<\/strong><\/td>\n8Gb (1G × 8)<\/td>\n<\/tr>\n
Cell Type<\/strong><\/td>\nSLC (Single-Level Cell)<\/td>\n<\/tr>\n
Voltage (VCC)<\/strong><\/td>\n1.7V – 1.95V<\/td>\n<\/tr>\n
Bus Width<\/strong><\/td>\nx8<\/td>\n<\/tr>\n
Interface<\/strong><\/td>\nParallel, ONFI 1.0 Compliant<\/td>\n<\/tr>\n
Page Size<\/strong><\/td>\n(2048 + 64) bytes<\/td>\n<\/tr>\n
Block Size<\/strong><\/td>\n(128K + 4K) bytes = 64 pages per block<\/td>\n<\/tr>\n
Plane Size<\/strong><\/td>\n2 planes per die, 2048 blocks per plane<\/td>\n<\/tr>\n
Die Stack<\/strong><\/td>\n2 × 4Gb die (Multi-die)<\/td>\n<\/tr>\n
ECC Requirement<\/strong><\/td>\n4-bit ECC per (512+16) bytes<\/td>\n<\/tr>\n
Random Read Access (tR)<\/strong><\/td>\n25 μs (typ.)<\/td>\n<\/tr>\n
Sequential Read Speed<\/strong><\/td>\n25 ns per byte<\/td>\n<\/tr>\n
Access Time<\/strong><\/td>\n22 ns<\/td>\n<\/tr>\n
Page Program Time<\/strong><\/td>\n320 μs (typ.), 600 μs (max)<\/td>\n<\/tr>\n
Block Erase Time<\/strong><\/td>\n1 ms (typ.), 3.5 ms (max)<\/td>\n<\/tr>\n
Active Current<\/strong><\/td>\n30 mA (max)<\/td>\n<\/tr>\n
Standby Current<\/strong><\/td>\n100 μA (max)<\/td>\n<\/tr>\n
Endurance<\/strong><\/td>\n100,000 P\/E cycles (typ.)<\/td>\n<\/tr>\n
Data Retention<\/strong><\/td>\n10 years<\/td>\n<\/tr>\n
\u5de5\u4f5c\u6e29\u5ea6<\/strong><\/td>\n-40°C to +85°C (Industrial)<\/td>\n<\/tr>\n
Guaranteed Good Block<\/strong><\/td>\nBlock #0 at shipping<\/td>\n<\/tr>\n
Secure OTP<\/strong><\/td>\nSupported (30 pages)<\/td>\n<\/tr>\n
Unique ID<\/strong><\/td>\nONFI standard<\/td>\n<\/tr>\n
Electronic Signature<\/strong><\/td>\n5 cycles<\/td>\n<\/tr>\n
Two-Plane Operations<\/strong><\/td>\nSupported<\/td>\n<\/tr>\n
Chip Enable Don’t Care<\/strong><\/td>\nSupported<\/td>\n<\/tr>\n
\u5305\u88c5<\/strong><\/td>\n63-VFBGA, 9mm × 11mm, 0.8mm ball pitch<\/td>\n<\/tr>\n
RoHS \/ Halogen-Free<\/strong><\/td>\nYes<\/td>\n<\/tr>\n<\/table>\n

\u7279\u70b9<\/h2>\n
    \n
  • 8Gb SLC NAND Flash with high reliability (100K P\/E cycles typical)<\/li>\n
  • 1.8V low-voltage operation (1.7V – 1.95V) for mobile and M2M applications<\/li>\n
  • Two 4Gb die stacked with interleaved die operation support<\/li>\n
  • ONFI 1.0 compliant parallel interface with command\/address\/data multiplexing<\/li>\n
  • Cache Read and Cache Program for improved throughput<\/li>\n
  • Two-Plane Program and Two-Plane Cache Program support<\/li>\n
  • Secure One-Time Programmable (OTP) area: 30 pages<\/li>\n
  • Unique ID Read (ONFI standard) and Electronic Signature (5 cycles)<\/li>\n
  • Hardware write protection via WP# pin<\/li>\n
  • Chip Enable Don’t Care for simplified system interface<\/li>\n
  • Low power: 30 mA active \/ 100 μA standby<\/li>\n
  • Industrial temperature range: -40°C to +85°C<\/li>\n<\/ul>\n

    \u5e94\u7528<\/h2>\n
      \n
    • Mobile phones and 3G\/4G\/5G data cards requiring low-voltage NAND storage<\/li>\n
    • M2M (Machine-to-Machine) devices and IoT edge nodes<\/li>\n
    • Embedded system code and data storage in portable electronics<\/li>\n
    • Industrial control systems with 1.8V logic<\/li>\n
    • Boot code and configuration storage in low-power FPGA \/ SoC platforms<\/li>\n<\/ul>","protected":false},"excerpt":{"rendered":"

      Product Overview The MX60UF8G18AC-XKI is a 1.8V, 8Gb SLC (Single-Level Cell) NAND Flash Memory device from Macronix (MXIC), belonging to the MX60UF 1.8V family. It is stacked from two 4Gb die, each organized with two planes of 2048 blocks. The device features a (2048+64)-byte page size, (128K+4K)-byte block size, ONFI 1.0 compliant interface, and supports […]<\/p>\n","protected":false},"author":2,"featured_media":12420,"comment_status":"open","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[13,3387],"tags":[3369],"chip_brand":[187],"class_list":["post-12381","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-integrated-circuits-ics","category-memory","tag-mx60uf8g18ac-xki","chip_brand-mxic"],"acf":{"brief_explanation":"1.8V 8Gb SLC NAND Flash, ONFI 1.0, 2K+64B page, 100K P\/E cycles, 63-VFBGA 9x11mm Industrial","date_code":"","package_case":"63-VFBGA (9mm x 11mm, 0.8mm pitch)","in_stock":5634,"datasheet":"https:\/\/www.macronix.com\/Lists\/Datasheet\/Attachments\/8477\/MX60UF8G18AC,%201.8V,%208Gb,%20v1.0.pdf","price":"","product_introduction":"The MX60UF8G18AC-XKI is a 1.8V, 8Gb SLC NAND Flash Memory device from Macronix, belonging to the MX60UF 1.8V family designed for mobile and M2M embedded applications. It is stacked from two 4Gb die, each organized with two planes of 2048 blocks, where each block contains 64 pages of (2048+64) bytes. The device supports the ONFI 1.0 standard interface with command\/address\/data multiplexing on an 8-bit bus. Key features include Cache Read\/Cache Program, Two-Plane operations, Secure OTP (30 pages), Unique ID Read (ONFI), and Electronic Signature (5 cycles). With a typical P\/E endurance of 100K cycles (requiring 4-bit ECC per 528 bytes) and 10-year data retention, the MX60UF8G18AC-XKI is ideal for low-voltage embedded system code and data storage. The -XKI suffix denotes the 63-VFBGA (9x11mm) industrial-grade package.","working_principle":"The MX60UF8G18AC-XKI operates as a 1.8V parallel SLC NAND Flash memory with an ONFI 1.0 compliant interface. Commands, addresses, and data are multiplexed through the 8-bit I\/O[7:0] bus, controlled by CLE (Command Latch Enable), ALE (Address Latch Enable), CE# (Chip Enable), WE# (Write Enable), RE# (Read Enable), and WP# (Write Protect) signals. Read operations: A Read command (00h-30h) initiates page transfer from the NAND array to the 2112-byte page buffer (tR = 25us typical), after which data is output sequentially at 25ns per byte on RE# falling edges. Cache Read allows overlapping array-to-buffer transfer of the next page while the current page is being output. Program operations: A Page Program command (80h-10h) loads data from I\/O into the page buffer and programs the selected page (320us typical). Cache Program (80h-15h) allows pipelined programming. Two-Plane Program enables simultaneous programming of two pages on different planes. Erase operations: A Block Erase command (60h-D0h) erases a 128K+4K byte block in 1ms typical. The two stacked 4Gb die share a single CE# and R\/B# signal (Mode A). The R\/B# open-drain output indicates device busy\/ready status.","pin_description":"\n
      Ball<\/th>Name<\/th>Type<\/th>Function<\/th><\/tr>\n
      A3<\/td>WP#<\/td>Input<\/td>Write Protect (active low); low = block program\/erase disable<\/td><\/tr>\n
      A1, D1, G1, K1<\/td>VCC<\/td>Power<\/td>1.7V - 1.95V supply voltage<\/td><\/tr>\n
      A7, D7, G7, K7, M1<\/td>VSS<\/td>Ground<\/td>Ground connection<\/td><\/tr>\n
      B7, C7, J7, L7<\/td>NC<\/td>—<\/td>Not connected internally<\/td><\/tr>\n
      C6<\/td>CE#<\/td>Input<\/td>Chip Enable (active low); high = standby, low = active<\/td><\/tr>\n
      D6<\/td>WE#<\/td>Input<\/td>Write Enable; address\/data\/command latched at WE# rising edge<\/td><\/tr>\n
      E5<\/td>CLE<\/td>Input<\/td>Command Latch Enable; high = command on I\/O at WE# rising<\/td><\/tr>\n
      F5<\/td>ALE<\/td>Input<\/td>Address Latch Enable; high = address on I\/O at WE# rising<\/td><\/tr>\n
      F6<\/td>RE#<\/td>Input<\/td>Read Enable; data output tREA after RE# falling edge<\/td><\/tr>\n
      G8<\/td>R\/B#<\/td>Output (OD)<\/td>Ready\/Busy status (open-drain); low = busy, high = ready<\/td><\/tr>\n
      H7, H6, J5, J6, K5, L5, L6, M6<\/td>I\/O[7:0]<\/td>I\/O<\/td>Multiplexed command\/address\/data bus<\/td><\/tr>\n
      H5<\/td>DNU<\/td>—<\/td>Do Not Use (do not connect)<\/td><\/tr>\n<\/table>","application_scenarios":"
        \n
      • Mobile phone and 3G\/4G\/5G data card mass storage at 1.8V logic level<\/li>\n
      • M2M (Machine-to-Machine) devices and IoT edge nodes requiring low-voltage NAND<\/li>\n
      • Portable and wearable electronics embedded code and data storage<\/li>\n
      • Industrial control systems with 1.8V rail and high reliability SLC endurance (100K P\/E cycles)<\/li>\n
      • Low-power FPGA \/ SoC boot media and configuration storage in battery-powered platforms<\/li>\n<\/ul>","alternative_models":"\n
        Manufacturer<\/th>Part Number<\/th>Package<\/th>Notes<\/th><\/tr>\n
        Macronix<\/td>MX60UF8G28AD-XKI<\/td>63-VFBGA<\/td>8Gb 1.8V SLC, 4K page, 8-bit ECC, newer AD generation<\/td><\/tr>\n
        Macronix<\/td>MX60LF8G18AC<\/td>48-TSOP \/ 63-VFBGA<\/td>8Gb 3V SLC, 2K page, 4-bit ECC (3V version)<\/td><\/tr>\n
        Macronix<\/td>MX30UF4G18AB<\/td>48-TSOP \/ 63-VFBGA<\/td>4Gb 1.8V SLC, 2K page, 4-bit ECC, single-die<\/td><\/tr>\n
        Winbond<\/td>W25N01KV<\/td>8-SOIC \/ WSON<\/td>1Gb SLC SPI NAND alternative<\/td><\/tr>\n
        Micron<\/td>MT29F8G08AABAH4<\/td>48-TSOP<\/td>8Gb SLC NAND, 3V, ONFI 2.1<\/td><\/tr>\n<\/table>"},"_links":{"self":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/posts\/12381","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/comments?post=12381"}],"version-history":[{"count":1,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/posts\/12381\/revisions"}],"predecessor-version":[{"id":12419,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/posts\/12381\/revisions\/12419"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/media\/12420"}],"wp:attachment":[{"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/media?parent=12381"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/categories?post=12381"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/tags?post=12381"},{"taxonomy":"chip_brand","embeddable":true,"href":"https:\/\/ic-vendor.com\/zh\/wp-json\/wp\/v2\/chip_brand?post=12381"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}