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MAX7313AEG+T


16 端口 I2C I/O 扩展器,带 8 位 PWM LED 强度,热插入式,QSOP-24 T/R

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制造商零件:

MAX7313AEG+T

包装:

QSOP-24(8.65 x 3.9 毫米)

品牌:
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说明

MAX7313AEG+T 是 Analog Devices (Maxim) 推出的一款 16 端口 I/O 扩展器,集成了 8 位 PWM LED 强度控制、中断和热插入保护功能,采用 QSOP-24 (8.65×3.9 mm) 卷带封装。每个 I/O 端口均可单独配置为 50 mA/5.5V 开路漏极电流灌输输出或具有过渡检测功能的逻辑输入。PWM 调光:4 位全局(14 级)x 4 位单个(16 级)= 224 级强度。每个输出有两相闪烁引擎。400 kbps I2C/SMBus,通过 AD0-AD2 引脚支持 64 个地址。热插拔:所有引脚在 V+=0V 时均为高 Z,最高可达 6V。待机:1.2 µA typ.电源电压电源:2V-3.6V。温度:-40C 至 +125C。MSL-1、RoHS、EAR99。引脚/软件兼容 MAX7311、PCA9535、PCA9555。.

MAX7313AEG+T 是一款 16 端口 I/O 扩展器,集成了 8 位 PWM LED 强度控制、过渡检测中断和热插入保护功能,由 Analog Devices(前身为 Maxim Integrated)生产。它专为需要 GPIO 扩展和 LED 驱动能力的应用而设计,例如键盘/LCD 背光、RGB LED 驱动器和状态指示灯阵列。.

该器件提供 16 个 I/O 端口(P0-P15),每个端口均可单独配置为额定电流为 50 mA、电压为 5.5V 的漏极开路电流吸收输出,或具有过渡检测功能的逻辑输入。第 17 个端口 (INT/O16) 可用作过渡检测中断输出或通用开漏输出。开漏输出可直接驱动 LED,或通过外部电阻上拉至 5.5V 提供逻辑电平输出。.

集成的 8 位 PWM 电流驱动器可提供复杂的 LED 调光控制。PWM 架构将 8 位控制分成两个区域:4 位全局控制同时适用于所有输出,提供从完全关闭到完全打开的 14 个粗强度步进。然后,每个输出都有一个单独的 4 位控制,将全局设置的电流进一步细分为 16 个细步,每个输出可产生多达 224(14 x 16)个有效强度级别。或者,也可以将电流控制配置为单个 8 位寄存器,统一设置所有输出。.

每个输出都支持两个闪烁阶段(0 相和 1 相)的独立闪烁定时。所有 LED 都可单独设置为在任一闪烁阶段开启或关闭,或完全忽略闪烁控制。闪烁周期由寄存器控制,可配置闪烁模式,用于吸引注意力的指示灯或状态代码。两阶段架构可将 LED 分成独立的闪烁组,而无需主机处理器干预。.

MAX7313 通过兼容 400 kbps I2C/SMBus 的两线串行接口进行通信。该器件通过三个地址输入引脚(AD0、AD1、AD2)支持 64 个唯一的 I2C 地址,每个地址输入引脚均可连接至 GND、V+、SCL 或 SDA,因此单个 I2C 总线上最多可连接 64 个 MAX7313 器件(共 1024 个 I/O 端口)。.

热插拔保护是其主要功能之一:所有端口引脚、INT、SDA、SCL 和 AD0-AD2 在掉电期间(V+ = 0V)均保持高阻抗,电压最高可达 6V,可防止在带电插入/拔出时损坏。输入过压保护电压为 5.5V。.

后缀 AEG+T 表示卷带式 QSOP-24 封装(每卷 2,500 件)。+ 表示符合无铅/RoHS 标准。该器件工作电压为 2V 至 3.6V,待机电流仅为 1.2 µA(典型值)和 3.6 µA(最大值)。工作温度范围为 -40C 至 +125C。MAX7313 与 MAX7311(无 PWM)、PCA9535 和 PCA9555 I/O 扩展器引脚兼容,软件兼容。.

该器件采用 BiCMOS 工艺技术,结合了双极输出驱动能力和 CMOS 逻辑效率。MSL 评级为 1 级(峰值回流温度为 260 摄氏度时的无限底板寿命)。ECCN 为 EAR99。.

MAX7313AEG+T 是一款可通过 I2C 寻址的 16 端口 I/O 扩展器,集成了 PWM LED 电流控制功能,将 GPIO 扩展和 LED 驱动集于单个器件中。.

I2C 接口和寻址:该器件通过标准 I2C/SMBus 接口进行通信,速度高达 400 kbps。7 位从属地址由 AD0、AD1 和 AD2 引脚决定,每个引脚可连接到四种状态(GND、V+、SCL、SDA)之一,从而产生 64 个唯一地址。这样,一条 I2C 总线上最多可连接 64 个 MAX7313 器件。主机可使用标准 I2C 读/写协议写入配置、输出、PWM 和闪烁寄存器,读取输入、中断和状态寄存器。.

I/O 端口配置:16 个端口(P0-P15)中的每个端口都可通过一对 8 位配置寄存器(P0-P7 和 P8-P15 各一个)进行单独配置。当配置为输出时,端口作为开漏电流灌,在高达 5.5V 的电压下可输出高达 50 mA 的电流。配置为输入时,端口具有过渡检测电路,可监控逻辑电平变化。输入阈值以 V+ 为基准,输入受 5.5V 过压保护,即使 V+ 低至 2V,也能直接连接到 5V 逻辑系统。.

PWM 电流控制结构:8 位 PWM 电流控制采用分层方案。4 位全局强度寄存器(O0-O3)设置同时应用于所有输出的粗电流电平。这提供了 14 个有效的强度步进(完全关闭是第 0 步,然后从最小到完全开启有 14 个步进)。然后,每个输出的 4 位单独强度寄存器(I0-I3)将全局设置的电流分成 16 个更细的步长。每个输出的有效占空比与 (Global + 1) x (Individual + 1) / (16 x 16) 成正比,最多可提供 224 个独特的强度级别。PWM 频率来自一个内部振荡器,通常为 1.5 kHz,速度之快足以避免 LED 应用中的明显闪烁。.

另外,还可将 PWM 控制切换为统一的 8 位模式,在这种模式下,单个 8 位寄存器可将所有输出设置为相同的强度,适用于统一背光调光等应用。.

双相闪烁引擎:每个输出都有两个闪烁相位(0 相和 1 相)。在第 0 阶段,输出可设置为开、关或闪烁;在第 1 阶段,输出可独立设置为开、关或闪烁。所有输出共享相同的闪烁时序(由闪烁周期寄存器控制),但每个输出可独立选择其在每个阶段的行为。两阶段架构可将 LED 组合成同步闪烁模式:例如,第 0 阶段可使红色 LED 亮起,绿色 LED 熄灭,而第 1 阶段则相反,这样就可创建一种交替模式,而无需任何主机 CPU 开销。.

转换检测和中断:当任何输入配置端口检测到逻辑电平转换(上升沿或下降沿)时,该转换将被锁存在转换检测寄存器中。当检测到任何转换时,INT 输出(低电平有效、开漏)断开,为主机处理器提供中断。主机通过读取过渡检测寄存器来确定哪个端口发生了变化,然后通过读取寄存器来清除中断。这样就无需轮询,减少了主机 CPU 的开销。.

热插入保护:掉电期间(V+ = 0V),内部电路监控 V+,并将所有 I/O 引脚、SDA、SCL、INT 和 AD0-AD2 保持在高阻抗状态。这可防止寄生传导路径,以免在将包含 MAX7313 的卡插入供电系统时损坏器件或破坏 I2C 总线。在这种状态下,输入可承受高达 6V 的电压,超过 5.5V 的工作范围。.

待机模式:当所有输出关闭且无 I2C 通信发生时,器件进入低功耗待机状态,功耗仅为 1.2 µA(典型值)。I2C 接口保持激活状态,可在地址匹配时唤醒器件。过渡检测电路在待机时也保持激活状态,允许在接近零功耗的情况下进行中断驱动的输入监控。.

针脚 名称 类型 默认功能 说明
1 P0 输入/输出 端口 0 开漏输入/输出;可配置为 50mA/5.5V 电流沉降输出或带转换检测功能的逻辑输入
2 P1 输入/输出 端口 1 开漏 I/O;功能与 P0 相同
3 P2 输入/输出 端口 2 开漏 I/O
4 P3 输入/输出 端口 3 开漏 I/O
5 P4 输入/输出 端口 4 开漏 I/O
6 P5 输入/输出 端口 5 开漏 I/O
7 P6 输入/输出 港口 6 开漏 I/O
8 P7 输入/输出 端口 7 开漏 I/O
9 接地 G 地面 设备接地;GND 引脚的总电流不得超过 350 mA
10 P8 输入/输出 端口 8 开漏 I/O;功能与 P0-P7 相同
11 P9 输入/输出 端口 9 开漏 I/O
12 P10 输入/输出 端口 10 开漏 I/O
13 P11 输入/输出 港口 11 开漏 I/O
14 P12 输入/输出 港口 12 开漏 I/O
15 P13 输入/输出 港口 13 开漏 I/O
16 P14 输入/输出 港口 14 开漏 I/O
17 P15 输入/输出 港口 15 开漏 I/O
18 AD0 I 地址位 0 I2C 从站地址选择;连接至 GND、V+、SCL 或 SDA,用于 4 态编码
19 SCL I I2C 时钟 I2C/SMBus 串行时钟输入;5.5V 容差;热插拔保护
20 SDA 输入/输出 I2C 数据 I2C/SMBus 串行数据输入/输出;开漏;5.5V 容差;热插拔保护
21 INT/O16 O 中断/端口 16 低电平有效开漏中断输出(7V,额定 50mA)或通用输出;在检测到输入转换时断言
22 V+ P 电源 正电源电压,2V 至 3.6V;使用 0.047 µF 陶瓷电容器旁路至 GND
23 AD1 I 地址位 1 I2C 从站地址选择;连接至 GND、V+、SCL 或 SDA
24 AD2 I 地址位 2 I2C 从站地址选择;连接至 GND、V+、SCL 或 SDA
应用 说明
键盘和 LCD 背光 16 个具有 PWM 调光功能的开漏输出可驱动白色或彩色 LED 背光;全局和单个强度控制可实现键盘和 LCD 面板的统一亮度
RGB LED 状态阵列 两相闪烁引擎可为多色状态指示灯创建交替的 RGB 模式;每组输出独立的 PWM 可为每个 RGB LED 组实现平滑的色彩混合
笔记本电脑控制器 热插拔保护允许在热插拔托架中安全使用;GPIO 扩展用于键盘矩阵、触摸板按钮和 LED 指示灯;1.2 µA 待机电流可延长电池寿命
便携式医疗设备 16 个 I/O 端口将按钮输入(具有中断驱动的转换检测功能)和 LED 状态输出集成在一个芯片中;超低待机电流可延长电池工作时间
工业面板指示灯 64 地址 I2C 总线允许在一条总线上连接 64 个设备(1024 个 I/O 端口),适用于大型指示面板;-40C 至 +125C 的温度范围适合恶劣的工业环境
模型 制造商 兼容性 主要区别
MAX7313AEG+ ADI/Maxim 引脚兼容/电气相同 管式包装(50/管)代替卷带包装;相同的硅;用于原型开发和小批量生产
MAX7313ATG+T ADI/Maxim 功能相同 TQFN-24(4×4 毫米)封装,带裸露焊盘;占用空间更小、散热性能更好;不同的焊盘模式
MAX7312AEG+T ADI/Maxim 引脚兼容/软件兼容 16 端口 I/O 扩展器,不带 PWM/闪烁功能;相同的 I2C 地址方案和引脚输出;不需要 LED 调光时成本更低
PCA9535DBT 恩智浦 功能相似 16 位 I2C I/O 扩展器,无 PWM,每路输出 25 mA;软件与 MAX7311 兼容,但由于 PWM 寄存器的原因,与 MAX7313 不兼容
MAX7315AUG+T ADI/Maxim 功能相似 8 端口版本,带 PWM 和闪烁功能;I/O 数量减半,采用较小的 TSSOP-16 或 QFN-16 封装;相同的 PWM 架构
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2. Genuine Product Guarantee & Full-process Quality Inspection

All products are sourced from official authorized channels and are 100% original genuine parts. Every batch of goods undergoes strict full-process quality inspection before delivery, with complete batch records and traceability documents provided. Our products comply with AEC-Q standards for automotive electronics and high-reliability specifications for medical devices. We eliminate counterfeits, refurbished parts and defective products from the source to secure your project production.

3. Fast Quotation & Order Processing

Our customer service team responds promptly to inquiries and quotation requests. All in-stock orders will be processed within one working day. We provide stocking reservation services for long-term cooperative customers, effectively solving problems such as component shortages and unstable supply chains.

4. Professional Technical Support

Our senior engineer team provides free technical consultation, model selection guidance and original manufacturer datasheets. We assist customers in solving problems related to product R&D, circuit design and component application, providing reliable technical support for project progress.

5. Sourcing for Special Components

Relying on our global supply chain network, we professionally source scarce components, obsolete parts and customized special components to efficiently solve your procurement difficulties.

6. Global Logistics & Document Services

We cooperate with mainstream international logistics providers including DHL, FedEx, UPS and TNT to achieve fast global delivery. We can provide complete export documents such as customs declaration files, commercial invoices and packing lists to ensure smooth customs clearance for international shipments. Local pickup is also available for customers in Shenzhen, China.

Professional Packaging Standards

Electronic components are sensitive to static electricity, collision, moisture and dust. We adopt industry-standard anti-static packaging solutions to fully ensure the integrity of goods during transportation and storage.

1. General Packaging Specifications

  • All components are packed separately to avoid damage caused by friction and collision;
  • Shockproof buffer materials are added for fragile products to ensure transportation safety;
  • Each package is clearly marked with part number, quantity, batch number and specifications for easy inventory counting and management.

2. Classified Professional Packaging

  • Anti-static Packaging: Static-sensitive components such as chips, circuit boards and sensors are packaged with anti-static bags, shielding boxes and conductive foam in strict accordance with international anti-static standards to prevent static damage.
  • Vacuum Moisture-proof Packaging: Moisture-sensitive components are vacuum-sealed with desiccants to isolate humid air, suitable for ocean transportation and long-term storage.
  • Original Factory Packaging: Integrated circuits of brands such as NXP are delivered with original reels, trays or tubes by default, retaining complete original packaging and adapting to automated SMT production lines.
  • Discrete Device Packaging: Discrete devices such as SMD resistors, power resistors and LEDs are quantitatively and classifiedly packaged with accurate quantity and clear marking.
  • Connector / Aviation Connector Packaging: Hard outer packaging is adopted to prevent pin bending and structural deformation.

3. Custom Packaging Services

We provide value-added services including personalized packaging, custom labeling and re-reeling according to customer requirements, fully matching your production and warehouse management standards.

Contact Information

For service consultation or packaging customization, please feel free to contact us:
Email: info@ic-vendor.com
Tel / WhatsApp: +86 13760382860
Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong, China
 

Online Inquiry Form

Support Excel, PDF, CSV format files for full BOM list quotation

Submit your component procurement and custom packaging needs via the form below. We will provide a detailed quotation and professional solution within 1–8 working hours.