CC0201KRX7R6BB222

The CC0201KRX7R6BB222 is a 2.2nF X7R dielectric multilayer ceramic capacitor from Yageo’s CC series, housed in the ultra-compact 0201 (0603 Metric) surface-mount package. Measuring just 0.6mm × 0.3mm × 0.3mm, this tiny MLCC delivers significant capacitance density — 2.2 nanofarads at 10V in one of the smallest standard SMT packages available — making it ideal for the most space-constrained electronic designs.

The X7R dielectric used in this capacitor is an EIA Class 2 material, meaning it provides high capacitance per unit volume (volumetric efficiency) at the cost of some capacitance variation with temperature, voltage, and time. X7R specifies that capacitance changes by no more than ±15% over the -55°C to +125°C operating temperature range (relative to 25°C). The K tolerance code indicates ±10% initial capacitance tolerance at room temperature.

X7R capacitors exhibit an aging effect — a gradual decrease in capacitance over time due to gradual reordering of the ferroelectric domains in the ceramic material. The aging rate for X7R is typically about 1% per decade hour, meaning after 1,000 hours the capacitance may decrease by approximately 3%. This aging is recoverable by subjecting the capacitor to temperatures above its Curie temperature (around 125°C), which effectively “resets” the aging clock.

The CC series from Yageo features base metal electrode (BME) technology with nickel internal electrodes and a nickel-barrier external termination system with tin plating. This construction provides excellent solderability and reliability while meeting all current RoHS and halogen-free environmental requirements. The wraparound termination design ensures robust mechanical and electrical connection to the PCB.

Supplied on 7-inch paper tape reels (code R suffix) with 15,000 pieces per reel, the CC0201KRX7R6BB222 is optimized for high-speed, high-volume SMT assembly lines. With MSL Level 1 classification, no dry packing or bake-out is required before use, simplifying inventory management and reducing manufacturing overhead.

These tiny capacitors find widespread use in mobile phones, wearables, IoT devices, and any application where PCB space is at a premium and high-density decoupling, filtering, or signal conditioning is needed.

An X7R multilayer ceramic capacitor stores electrical energy through the polarization of ferroelectric ceramic material between interleaved conductive electrodes. The “X7R” designation specifies its temperature characteristic: X = -55°C minimum, 7 = +125°C maximum, R = ±15% capacitance change over that range.

In the CC0201KRX7R6BB222, the capacitor is constructed from many thin layers of X7R ceramic dielectric interleaved with internal metal electrodes. X7R is a Class 2 dielectric based on barium titanate (BaTiO3) with carefully formulated dopants and modifiers that shift the Curie temperature (the temperature of maximum capacitance) and broaden the capacitance-temperature curve to achieve the ±15% tolerance specification over the full -55°C to +125°C range.

The fabrication process begins with ceramic “green tape” — thin, flexible sheets of ceramic powder mixed with organic binders and solvents. Internal electrodes (typically nickel for base metal electrode technology) are printed onto the green tape using a precision screen-printing or thin-film deposition process. Multiple printed sheets are then stacked, with each layer offset slightly so that alternating electrodes connect to opposite ends of the chip.

The stack is laminated under heat and pressure to bond the layers together, then carefully cut into individual chips of the 0201 size (0.6mm × 0.3mm). The green chips are then fired at high temperature (typically 1000°C to 1300°C in a reducing atmosphere for nickel electrodes) where the organic binders burn off and the ceramic particles sinter together, forming a dense, monolithic ceramic body with embedded conductive electrodes.

After firing, end terminations are applied. A conductive paste (typically copper-based) is applied to each end of the chip and fired to form the base termination that connects to the alternating internal electrodes. This is followed by electroplating a nickel barrier layer (to prevent solder leaching during PCB assembly) and an outer tin plating layer (to provide excellent solderability).

When voltage is applied across the capacitor, the barium titanate dielectric polarizes — the titanium ions within the perovskite crystal structure shift position, creating electric dipoles that align with the applied field. This ferroelectric polarization stores a large amount of charge per unit volume, giving X7R capacitors their high volumetric efficiency compared to Class 1 (C0G) dielectrics.

However, this ferroelectric nature also causes several characteristic behaviors: voltage dependence (capacitance decreases with increasing DC bias), temperature dependence (the ±15% X7R specification), and aging (capacitance decreases logarithmically over time as ferroelectric domains gradually relax). These effects are intrinsic to the material and must be considered in circuit design.

For the CC0201KRX7R6BB222, the 2.2nF at 10V rating in the tiny 0201 package is achieved by using many very thin dielectric layers — often 20, 30, or more layers — each only a few micrometers thick. The total capacitance is the capacitance of each layer multiplied by the number of active layers, allowing impressive capacitance values in extremely small packages.

Note: The CC0201KRX7R6BB222 is a non-polarized capacitor. Either terminal can be connected to either side of the circuit. The 0201 package is extremely small — 0.6mm × 0.3mm — requiring precision SMT placement equipment and careful solder paste application for reliable assembly.

• Smartphones and feature phones — IC decoupling and filtering
• Wearable electronics — smartwatches, fitness trackers, hearables
• IoT sensor nodes and miniature wireless devices
• Digital IC power supply decoupling (VCC to GND)
• High-density PCB designs with limited board space
• Tablet computers and ultra-mobile PCs
• Bluetooth modules and wireless accessories
• Camera modules and image sensors
• Medical wearables and implantable devices
• Signal filtering in compact audio circuits