Product Overview
The EP2C15AF256C6N is a field-programmable gate array (FPGA) from Altera (now Intel) Cyclone® II family, offering a balanced mix of logic resources, memory, and I/O capabilities at a low cost point. Housed in a 256-pin FineLine BGA package, this device features 14,448 logic elements (LEs), 52 M4K RAM blocks totaling 239,616 bits of embedded memory, 26 embedded 18×18 multipliers, 4 phase-locked loops (PLLs), and up to 180 user I/O pins. Built on a 1.2V core architecture with TSMC’s 90nm process technology, the Cyclone II family delivers low power consumption and high value for cost-sensitive applications. With support for various I/O standards, DDR SDRAM interfaces, and Nios® II soft processor implementation, the EP2C15AF256C6N is ideal for consumer electronics, industrial control, automotive, communications, and data processing applications requiring flexible logic implementation at a low cost.
Key Specifications
| Parameter | Value |
| Manufacturer | Altera (Intel® PSG) |
| Part Number | EP2C15AF256C6N |
| Product Family | Cyclone® II |
| Product Type | Field Programmable Gate Array (FPGA) |
| Logic Elements (LEs) | 14,448 |
| Logic Array Blocks (LABs) | 903 (each containing 16 LEs) |
| Equivalent Logic Gates | ~15,000 (LE count) |
| Embedded Memory (M4K Blocks) | 52 blocks (4,608 bits each) |
| Total RAM Bits | 239,616 bits |
| Embedded Multipliers | 26 (18 × 18-bit multipliers) |
| Phase-Locked Loops (PLLs) | 4 |
| Clock Networks | 16 global clock networks |
| Maximum User I/O Pins | Up to 180 (256-pin FBGA) |
| Core Voltage | 1.2 V (nominal) |
| I/O Voltage Support | 3.3 V, 2.5 V, 1.8 V, 1.5 V |
| I/O Standards | LVTTL, LVCMOS, SSTL, HSTL, PCI, LVDS, etc. |
| Differential I/O Support | LVDS, mini-LVDS, RSDS, etc. |
| External Memory Support | DDR SDRAM, DDR2 SDRAM, SDR SDRAM |
| Memory Interface Performance | Up to 167 MHz (DDR) |
| Internal Configuration Memory | No (requires external configuration device) |
| Configuration Modes | AS (Active Serial), PS (Passive Serial), JTAG |
| Speed Grade | -6 (fastest: -6, medium: -7, slowest: -8) |
| Operating Temperature | 0°C ~ +85°C (commercial, C grade) |
| Package / Case | 256-Pin FineLine BGA (FBGA256, 17mm × 17mm) |
| Mounting Type | Surface Mount |
| Process Technology | 90 nm TSMC |
| RoHS | RoHS Compliant |
| Product Status | Mature / Active |
Features
- Low-cost, low-power Cyclone II FPGA family
- 14,448 logic elements (LEs) for custom logic implementation
- 239,616 bits of embedded SRAM (52 × M4K blocks)
- 26 embedded 18×18 multipliers for DSP
- 4 phase-locked loops (PLLs) for clock management
- 16 global clock networks
- Up to 180 user I/O pins (256-pin FBGA)
- Single-ended I/O standards: LVTTL, LVCMOS 3.3/2.5/1.8/1.5V
- Differential I/O: LVDS, mini-LVDS, RSDS, LVPECL
- Memory interface: DDR SDRAM, DDR2, SDR SDRAM
- Support for Nios II soft embedded processor
- IP cores available: UART, SPI, I2C, Ethernet, DDR controller, etc.
- 1.2V core voltage for low power
- Multiple I/O banks with independent voltage support
- 90 nm process technology (TSMC)
- Configuration via serial flash, JTAG, or passive serial
- Commercial temperature range: 0°C ~ +85°C
- 256-pin FineLine BGA package (17×17mm)
- RoHS compliant
- Low cost for high-volume applications
Applications
- Consumer electronics (displays, set-top boxes)
- Industrial control and automation
- Automotive electronics
- Communications equipment
- Data processing and storage
- Video processing and display
- Nios II soft processor systems
- Motor control and drives
- Test and measurement equipment
- Cost-sensitive FPGA applications