EP2C15AF256C6N


Cyclone II FPGA, 14448 LE, 239Kb RAM, 26 multipliers, 4 PLLs, 256-FBGA, Altera EP2C15AF256C6N

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EP2C15AF256C6N

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256-Pin FineLine BGA (FBGA256, 17mm × 17mm), surface mount

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Description

Product Overview

The EP2C15AF256C6N is a field-programmable gate array (FPGA) from Altera (now Intel) Cyclone® II family, offering a balanced mix of logic resources, memory, and I/O capabilities at a low cost point. Housed in a 256-pin FineLine BGA package, this device features 14,448 logic elements (LEs), 52 M4K RAM blocks totaling 239,616 bits of embedded memory, 26 embedded 18×18 multipliers, 4 phase-locked loops (PLLs), and up to 180 user I/O pins. Built on a 1.2V core architecture with TSMC’s 90nm process technology, the Cyclone II family delivers low power consumption and high value for cost-sensitive applications. With support for various I/O standards, DDR SDRAM interfaces, and Nios® II soft processor implementation, the EP2C15AF256C6N is ideal for consumer electronics, industrial control, automotive, communications, and data processing applications requiring flexible logic implementation at a low cost.

Key Specifications

Parameter Value
Manufacturer Altera (Intel® PSG)
Part Number EP2C15AF256C6N
Product Family Cyclone® II
Product Type Field Programmable Gate Array (FPGA)
Logic Elements (LEs) 14,448
Logic Array Blocks (LABs) 903 (each containing 16 LEs)
Equivalent Logic Gates ~15,000 (LE count)
Embedded Memory (M4K Blocks) 52 blocks (4,608 bits each)
Total RAM Bits 239,616 bits
Embedded Multipliers 26 (18 × 18-bit multipliers)
Phase-Locked Loops (PLLs) 4
Clock Networks 16 global clock networks
Maximum User I/O Pins Up to 180 (256-pin FBGA)
Core Voltage 1.2 V (nominal)
I/O Voltage Support 3.3 V, 2.5 V, 1.8 V, 1.5 V
I/O Standards LVTTL, LVCMOS, SSTL, HSTL, PCI, LVDS, etc.
Differential I/O Support LVDS, mini-LVDS, RSDS, etc.
External Memory Support DDR SDRAM, DDR2 SDRAM, SDR SDRAM
Memory Interface Performance Up to 167 MHz (DDR)
Internal Configuration Memory No (requires external configuration device)
Configuration Modes AS (Active Serial), PS (Passive Serial), JTAG
Speed Grade -6 (fastest: -6, medium: -7, slowest: -8)
Operating Temperature 0°C ~ +85°C (commercial, C grade)
Package / Case 256-Pin FineLine BGA (FBGA256, 17mm × 17mm)
Mounting Type Surface Mount
Process Technology 90 nm TSMC
RoHS RoHS Compliant
Product Status Mature / Active

Features

  • Low-cost, low-power Cyclone II FPGA family
  • 14,448 logic elements (LEs) for custom logic implementation
  • 239,616 bits of embedded SRAM (52 × M4K blocks)
  • 26 embedded 18×18 multipliers for DSP
  • 4 phase-locked loops (PLLs) for clock management
  • 16 global clock networks
  • Up to 180 user I/O pins (256-pin FBGA)
  • Single-ended I/O standards: LVTTL, LVCMOS 3.3/2.5/1.8/1.5V
  • Differential I/O: LVDS, mini-LVDS, RSDS, LVPECL
  • Memory interface: DDR SDRAM, DDR2, SDR SDRAM
  • Support for Nios II soft embedded processor
  • IP cores available: UART, SPI, I2C, Ethernet, DDR controller, etc.
  • 1.2V core voltage for low power
  • Multiple I/O banks with independent voltage support
  • 90 nm process technology (TSMC)
  • Configuration via serial flash, JTAG, or passive serial
  • Commercial temperature range: 0°C ~ +85°C
  • 256-pin FineLine BGA package (17×17mm)
  • RoHS compliant
  • Low cost for high-volume applications

Applications

  • Consumer electronics (displays, set-top boxes)
  • Industrial control and automation
  • Automotive electronics
  • Communications equipment
  • Data processing and storage
  • Video processing and display
  • Nios II soft processor systems
  • Motor control and drives
  • Test and measurement equipment
  • Cost-sensitive FPGA applications

The EP2C15AF256C6N is a mid-range member of Altera’s Cyclone II FPGA family — the second generation of Cyclone low-cost FPGAs, designed to deliver maximum value for cost-sensitive high-volume applications. Manufactured on TSMC’s 90nm process technology with a 1.2V core voltage, Cyclone II devices offer significantly higher logic density and lower power consumption than the original Cyclone family at comparable cost points. The EP2C15A variant provides 14,448 logic elements organized into 903 logic array blocks (LABs), with each LAB containing 16 logic elements for efficient implementation of combinational and sequential logic functions. The embedded memory subsystem consists of 52 M4K RAM blocks, each providing 4,608 bits of configurable SRAM that can be configured as single-port, dual-port, or FIFO memory — totaling 239,616 bits of on-chip memory for data buffering, lookup tables, and processor scratchpad. For signal processing applications, 26 embedded 18×18-bit multipliers support efficient implementation of DSP functions including FIR filters, FFTs, and matrix operations. The 4 phase-locked loops (PLLs) provide flexible clock synthesis and multiplication/division, supporting a wide range of internal and external clock frequencies. The 256-pin FineLine BGA package provides up to 180 user I/O pins organized into multiple I/O banks, each supporting independent supply voltages to enable interfacing with different logic families. The FPGA supports a comprehensive set of single-ended and differential I/O standards including LVTTL, LVCMOS (3.3V/2.5V/1.8V/1.5V), SSTL, HSTL, PCI, LVDS, mini-LVDS, and RSDS — enabling direct connection to a wide variety of memory devices, peripherals, and communication interfaces. External memory support includes DDR SDRAM, DDR2 SDRAM, and SDR SDRAM interfaces for high-speed data storage. The Cyclone II architecture is fully supported by Altera’s Quartus II design software, which provides synthesis, place-and-route, timing analysis, and programming tools. Users can implement custom logic in Verilog or VHDL, or use Altera’s extensive library of IP cores including the Nios II soft embedded processor, DDR memory controllers, Ethernet MACs, and various communication peripherals. With its balanced mix of logic, memory, DSP, and I/O resources at a low cost, the EP2C15AF256C6N is well-suited for a wide range of applications from consumer electronics and automotive to industrial control and communications.

The Cyclone II FPGA is a SRAM-based programmable logic device whose internal configuration is stored in static RAM cells that control the function of logic elements, routing resources, and I/O buffers. At power-up, the FPGA has no defined function — it must be configured by loading a configuration bitstream from an external serial configuration device (EPCS serial flash), a microprocessor (passive serial mode), or via the JTAG interface. Once configured, the FPGA implements the user’s custom logic design. The fundamental logic building block is the logic element (LE), which contains a 4-input look-up table (LUT) that can implement any 4-input Boolean function, a programmable flip-flop for sequential logic, carry chain logic for arithmetic operations, and register chain connections for shift register implementation. LEs are organized into groups of 16 called logic array blocks (LABs), with each LAB having local interconnect resources that allow fast communication between LEs within the same block. The M4K memory blocks are 4,608-bit SRAM blocks that can be configured in various modes: single-port RAM, simple dual-port RAM, true dual-port RAM, shift register (RAM-based shift register), ROM, or FIFO buffer. Each M4K block also includes parity bits for error detection. The embedded 18×18 multipliers are dedicated hardware multiplier blocks that can perform 18×18-bit signed or unsigned multiplication in a single clock cycle, significantly improving the efficiency of DSP functions compared to implementing multipliers in general-purpose logic. The phase-locked loops (PLLs) provide clock synthesis capabilities including frequency multiplication, frequency division, phase shifting, and duty cycle programming. They are used to generate precise internal clock frequencies from an external reference clock, and to compensate for clock delay across the device. The general routing structure consists of horizontal and vertical routing channels of varying lengths (local, row, column, and global) that connect LABs, memory blocks, multipliers, and I/O pins. The I/O elements (IOEs) at the periphery of the device contain input, output, and output enable registers, and support a wide range of I/O standards with programmable drive strength, slew rate control, and bus hold features. When implementing a design, the Quartus II software synthesizes the user’s HDL code into logic elements, then performs place-and-route to map the logic onto the physical FPGA resources and configure the routing interconnect. The resulting configuration bitstream is downloaded to the FPGA either at power-up (from external flash) or via JTAG for development and testing.

The EP2C15AF256C6N is available in a 256-pin FineLine BGA package (17mm × 17mm). Major pin groups:

Pin Group Approx. Count Description
Power Pins ~50 VCCINT (1.2V core), VCCIO (I/O banks), VCCA_PLL (analog)
Ground Pins ~40 GND (multiple pins for power distribution)
User I/O Pins Up to 180 General-purpose I/O, organized into I/O banks
I/O Bank 1 ~32 Left-side I/O bank (top)
I/O Bank 2 ~32 Left-side I/O bank (bottom)
I/O Bank 3 ~32 Right-side I/O bank (top)
I/O Bank 4 ~32 Right-side I/O bank (bottom)
I/O Bank 5 ~26 Top-side I/O bank
I/O Bank 6 ~26 Bottom-side I/O bank
Clock Inputs 16 Dedicated clock input pins (CLK[0..15])
PLL Clock Outputs 8 PLL external clock outputs (PLL[1..4]_OUT)
Configuration Pins ~10 DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE, nCE, nCSO, ASDO
JTAG Pins 4 TCK, TMS, TDI, TDO
Test Pins 2 TEST_IN, TEST_OUT (factory test)
LVDS Channels ~20 diff. pairs Differential I/O pairs (left and right banks)

Note: Exact I/O count depends on how many pins are used for power, ground, configuration, and clock functions. The number of available user I/Os varies based on package and pin usage. Refer to the official Cyclone II EP2C15 datasheet and pin files for complete pin assignments and I/O bank descriptions.

  • Consumer Electronics: Used in flat-panel display controllers, set-top boxes, DVD/Blu-ray players, digital TVs, and gaming peripherals for video processing, display timing control, and interface bridging
  • Industrial Control & Automation: Deployed in PLC I/O modules, industrial sensor interfaces, motion controllers, and factory automation equipment for real-time signal processing, custom logic control, and communication protocol implementation
  • Automotive Electronics: Used in automotive infotainment systems, driver assistance cameras, and body electronics (with automotive-grade variants) for video processing, sensor interfaces, and custom control logic
  • Communications Equipment: Found in network switches, routers, modems, and VoIP gateways for packet processing, protocol conversion, and interface bridging functions
  • Video Processing & Display: Used in video scalers, format converters, video capture cards, and display controllers where parallel processing of pixel data and custom timing generation are required
  • Nios II Soft Processor Systems: Implements Nios II embedded processor systems with custom peripherals, providing a flexible software-programmable platform for applications that need both processor and custom hardware acceleration
  • Motor Control & Drives: Used in industrial motor drives and servo controllers for high-speed current loop implementation, PWM generation, encoder interfaces, and custom control logic acceleration
  • Test & Measurement Equipment: Deployed in oscilloscopes, data loggers, spectrum analyzers, and custom test equipment for data acquisition, signal processing, and high-speed data path implementation
Part Number Manufacturer Logic Elements RAM (Kb) Multipliers Package
EP2C15AF256C6N Altera/Intel 14,448 239 26 256-FBGA
EP2C8F256C6N Altera/Intel 8,256 165 18 256-FBGA
EP2C20F256C6N Altera/Intel 18,752 239 26 256-FBGA
EP2C35F484C6N Altera/Intel 33,216 483 35 484-FBGA
EP3C16F256C8N Altera/Intel 15,408 516 56 256-FBGA (Cyclone III)
XC6SLX16 Xilinx 14,579 227 32 256-BGA
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Quality is the core foundation of our long-term global cooperation. With over 20 years of experience in the electronic component industry, Materialparts has built a strict and standardized quality management system covering component sourcing, incoming inspection, full-batch testing, packaging and delivery. We are committed to delivering 100% genuine, high-reliability electronic components for industrial control, automotive electronics, consumer electronics and medical device industries, and fully safeguarding your production and R&D projects.

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Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong, China
 

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