LCMXO256C-4TN100C-3I

The LCMXO256C-4TN100C-3I is a MachXO family Crossover Programmable Logic Device (PLD) from Lattice Semiconductor. As a crossover PLD, the MachXO family bridges the gap between traditional CPLDs and FPGAs, combining CPLD-like features (instant-on, non-volatile, low cost, pin-locking) with FPGA-like capabilities (higher density, embedded memory, flexible I/O standards, PLLs on higher densities). The LCMXO256C features 256 Look-Up Tables (LUTs) of programmable logic, 128 macrocells, 192 registers, 78 user I/O pins, and 2048 bits of distributed RAM. With a wide core operating voltage range of 1.71V to 3.465V and support for multiple I/O standards including LVTTL, LVCMOS (3.3V/2.5V/1.8V/1.5V/1.2V), LVDS, and PCI, the device provides excellent interface flexibility for mixed-voltage systems. Eight global clock networks support complex multi-clock designs. Non-volatile flash memory provides instant-on operation (no external configuration ROM needed) and in-system programmability via the standard JTAG interface. Pin-locking capability allows design modifications without changing the PCB layout. Available in a 100-pin TQFP package at speed grade 4 with commercial temperature range (0°C to 85°C), the LCMXO256C is ideal for system-level glue logic, bus interfacing, power sequencing, configuration management, and other control-oriented applications in consumer, industrial, and communication systems.

The LCMXO256C operates as a non-volatile crossover PLD combining FPGA-style logic fabric with CPLD-like instant-on operation. Its functional architecture includes: 1) Logic Array Blocks (LABs): 32 LABs each containing 8 LUTs (total 256 LUTs) form the core logic fabric. Each 4-input LUT can implement any combinatorial function of four variables. Associated flip-flops can be configured as D, T, JK, or SR registers. LABs are interconnected through a global routing pool. 2) Distributed RAM: LUTs can be configured as distributed RAM (2048 bits total), providing small on-chip memory for data buffers, FIFOs, and shift registers without consuming dedicated block RAM resources. 3) I/O Banks: Two I/O banks with independent supply voltages support a variety of I/O standards. Each I/O pin includes an input register, output register, output enable, and programmable pull-up/down. Slew rate control helps manage signal integrity and EMI. LVDS differential I/O pairs support high-speed serial interfaces. 4) Clock Network: Eight global clock networks distribute clocks throughout the device with low skew. Multiple clock domains are supported for complex multi-clock designs. Clock pins can also be used as general I/O when not needed for clocking. 5) Non-Volatile Configuration: Flash-based non-volatile configuration memory stores the programmed design. On power-up, configuration data is loaded into the SRAM programming latches, providing instant-on operation. In-system programming via JTAG allows field updates. TransFR technology enables transparent reconfiguration while maintaining I/O states.

• System glue logic for embedded and computer systems
• Bus interface bridging and protocol translation
• Address decoding and chip select generation
• Power-up sequencing and system reset generation
• FPGA/ASIC configuration control and boot sequence management
• Display panel timing and control circuits
• Industrial control and monitoring logic
• Consumer electronics system management