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LPS25HBTR

Piezoresistive pressure sensor, 260-1260 hPa, 4µA, I2C/SPI, HLGA-10L 2.5x2.5x0.76mm

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Manufacturer Part：

LPS25HBTR

Package：

HLGA-10L (2.5 x 2.5 x 0.76 mm)

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Description

Product Overview

The LPS25HBTR from STMicroelectronics is a piezoresistive absolute pressure sensor functioning as a digital output barometer. It measures pressure from 260 to 1260 hPa with ultra-low current consumption of 4 µA. The device is housed in an HLGA-10L package measuring 2.5 x 2.5 x 0.76 mm and communicates via I2C or SPI interfaces.

Key Specifications

Pressure Range 260–1260 hPa
Supply Voltage 1.7V to 3.6V
Current Consumption 4 µA (typical)
Output Type Digital (I2C / SPI)
ODR Range 1 Hz to 25 Hz
Operating Temperature -30°C to +105°C
Package HLGA-10L, 2.5 x 2.5 x 0.76 mm
Embedded FIFO Yes
Packing Tape & Reel

Features

  • Ultra-thin package: only 0.76 mm height
  • Embedded FIFO for data batching and reduced host MCU load
  • Programmable ODR from 1 Hz to 25 Hz
  • Interrupt generation on threshold crossing or data-ready
  • Full-mold holed LGA package for moisture resistance
  • High design flexibility for wearable and IoT applications

Applications

  • Weather forecasting and barometric monitoring
  • Altitude and vertical speed measurement
  • Indoor navigation and floor detection
  • Enhanced GPS navigation
  • Smartphones, tablets, and wearables
  • IoT environmental sensor nodes

The LPS25HBTR is an ultra-thin piezoresistive absolute pressure sensor from STMicroelectronics, designed as a digital output barometer. The device integrates a monolithic sensing element with a mixed-signal ASIC in a full-mold holed LGA (HLGA) package. At only 0.76 mm thick, it offers high design flexibility for multifunctional applications including smartphones, tablets, wearables, and IoT devices. The LPS25HB improves upon previous generations with enhanced robustness, reliability, and moisture resistance while reducing package thickness. It operates from 1.7V to 3.6V with ultra-low 4 µA current consumption, making it suitable for battery-powered devices.

The LPS25HB operates through three main subsystems:

1. Sensing Element: A suspended membrane manufactured using ST’s dedicated MEMS process detects absolute pressure through piezoresistive principles. The membrane deflects under pressure changes, and integrated piezoresistors convert the mechanical deformation into electrical signals.

2. Signal Processing ASIC: A mixed-signal ASIC conditions the signal from the sensing element, performing amplification, ADC conversion, and digital compensation. Temperature compensation is applied to ensure accuracy across the operating range. The processed data is available as digital pressure values in hPa.

3. Digital Interface: The sensor communicates via I2C or SPI with an embedded 32-level FIFO that stores pressure data, reducing host MCU polling overhead. Programmable ODR (1–25 Hz) and interrupt generation on threshold crossing or data-ready events enable autonomous operation.

Pin Name Type Function
1 VDD_IO Power Power supply for I/O pins (1.7–3.6V)
2 CS Input SPI chip select / I2C address selection
3 INT1 Output Programmable interrupt
4 GND Power Ground
5 GND Power Ground
6 VDD Power Power supply (1.7–3.6V)
7 SPC I/O SPI clock / I2C SCL
8 SDI I/O SPI data in / I2C SDA
9 SDO Output SPI data out / I2C addr LSB
10 INT2 Output Programmable interrupt (FIFO)
  • Weather stations: Atmospheric pressure measurement for local weather prediction with 260–1260 hPa range
  • Wearable devices: Altimeter and vertical speed indication in smartwatches and fitness bands with 0.76mm thin package
  • Indoor navigation: Floor-level detection in malls and multi-story buildings using pressure differentials
  • Smartphones: Enhanced GPS navigation with barometric altitude compensation
  • IoT sensor nodes: Environmental monitoring with 4 µA ultra-low current and FIFO-based data batching
Manufacturer Part Number Package Notes
STMicroelectronics LPS22HBTR HLGA-10L (2.0×2.0) Smaller package, 10 µA current
STMicroelectronics LPS33HW Metal cap Water-resistant version
Bosch BMP280 LGA-8 (2.0×2.5) 300–1100 hPa, I2C/SPI
Bosch BMP388 LGA-10 (2.0×2.0) Higher resolution, lower power
TE Connectivity MS5803-02BA Stainless cap Waterproof, 10–2000 mbar
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Quality Assurance

Quality is the core foundation of our long-term global cooperation. With over 20 years of experience in the electronic component industry, Materialparts has built a strict and standardized quality management system covering component sourcing, incoming inspection, full-batch testing, packaging and delivery. We are committed to delivering 100% genuine, high-reliability electronic components for industrial control, automotive electronics, consumer electronics and medical device industries, and fully safeguarding your production and R&D projects.

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Contact Information

Email: info@ic-vendor.com

Tel / WhatsApp: +86 13760382860

Service & Packaging

Materialparts is a professional electronic component supplier based in Shenzhen, China, with over 20 years of global trading experience. We integrate component procurement, quality inspection, technical support, customized packaging, and global delivery services to provide one-stop supply chain solutions. Our business covers industrial control, automotive electronics, consumer electronics, medical devices and other industries. We always adhere to genuine sources, stable supply and considerate after-sales service.

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Contact Information

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Tel / WhatsApp: +86 13760382860
Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong, China
 

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