TMS320C6657CZHA


Dual-core C66x DSP, up to 1.25GHz, 40GMAC/20GFLOP per core, 1MB shared SRAM, SRIO/PCIe/GbE, FCBGA-625

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Manufacturer Part:

TMS320C6657CZHA

Package:

FCBGA-625 (CZH) - 21 x 21 x 2.25 mm, 0.8mm pitch

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Description

Product Overview

The TMS320C6657CZHA is a high-performance dual-core digital signal processor (DSP) from Texas Instruments, built on the KeyStone multicore architecture. Featuring two TMS320C66x DSP CorePacs operating at up to 1.25 GHz, this device delivers industry-leading fixed- and floating-point performance with 40 GMAC per core for fixed-point operations and 20 GFLOP per core for floating-point computations.

Packaged in a 625-pin flip-chip BGA (CZH) measuring 21 mm × 21 mm, the C6657 integrates a rich set of high-speed peripherals including Serial RapidIO 2.1 (4 lanes), PCI Express Gen2, HyperLink, Gigabit Ethernet, DDR3-1333 memory controller, and a 16-bit EMIF. The Multicore Navigator with 8192 hardware queues enables zero-overhead data transfers, while the on-chip hardware accelerators (VCP2, TCP3d) offload Viterbi and Turbo decoding operations.

Characterized for extended temperature operation from –40°C to 100°C, the TMS320C6657CZHA is fully backward compatible with all existing C6000 family fixed- and floating-point DSPs, ensuring software portability and reduced development cycles.

Key Specifications

Parameter Value
DSP Cores 2 × C66x fixed/floating-point
Core Frequency Up to 1.25 GHz
Fixed-Point Performance 40 GMAC per core @ 1.25 GHz
Floating-Point Performance 20 GFLOP per core @ 1.25 GHz
MSM SRAM 1024 KB (shared by both cores)
DDR3 Interface 32-bit, DDR3-1333, 4 GB addressable
SRIO 4 lanes, v2.1, up to 5 GBaud per lane
PCIe 1 port, Gen2, 1 or 2 lanes
Ethernet Gigabit (SGMII), 1 port
Package FCBGA (CZH), 625 pins, 21×21 mm
Operating Temperature –40°C to 100°C (extended)
Process Technology 40 nm

Features

  • Dual C66x DSP cores with up to 1.25 GHz clock frequency
  • Industry-leading 40 GMAC/20 GFLOP per core performance
  • Multicore Shared Memory Controller (MSMC) with 1024 KB MSM SRAM
  • Multicore Navigator with 8192 multipurpose hardware queues and packet-based DMA
  • Hardware accelerators: 2× Viterbi coprocessors (VCP2), 1× Turbo decoder (TCP3d)
  • High-speed interfaces: SRIO v2.1 (4 lanes), PCIe Gen2, HyperLink (40 Gbaud)
  • Gigabit Ethernet (SGMII) with 10/100/1000 Mbps support
  • 32-bit DDR3-1333 memory interface with 4 GB address space
  • 16-bit EMIF with Universal Parallel Port (uPP) supporting SDR/DDR transfers
  • Rich peripheral set: 2× UART, 2× McBSP, I²C, SPI, 32× GPIO, Semaphore module
  • Eight 64-bit timers, two on-chip PLLs
  • Extended temperature range: –40°C to 100°C
  • Backward compatible with C6000 family DSPs

Applications

  • Power protection and relay systems
  • Avionics and defense signal processing
  • Currency inspection and machine vision
  • Medical imaging and diagnostic equipment
  • Industrial transportation and railway systems
  • High-performance embedded computing
  • Software-defined radio (SDR) and communications infrastructure
  • Radar and sonar processing systems

The TMS320C6657CZHA is a dual-core high-performance digital signal processor from Texas Instruments’ KeyStone architecture family. It integrates two TMS320C66x DSP cores, each capable of operating at frequencies up to 1.25 GHz, delivering exceptional fixed-point (40 GMAC/core) and floating-point (20 GFLOP/core) performance.

The C66x core represents a significant advancement over previous C64x+ generations, incorporating 90 new instructions specifically targeting floating-point and vector math operations. With IEEE 754 compliance for double-precision and single-precision floating-point operations, the C6657 is well-suited for a broad range of high-performance signal processing applications including radar, medical imaging, communications infrastructure, and industrial automation.

Built on TI’s proven KeyStone multicore architecture, the C6657 features the Multicore Navigator for efficient inter-core and peripheral data movement, the TeraNet non-blocking switch fabric for high-bandwidth internal interconnect, and the Multicore Shared Memory Controller (MSMC) providing 1MB of shared SRAM with memory protection. The device also includes dedicated hardware accelerators for Viterbi and Turbo decoding, offloading these compute-intensive operations from the main DSP cores.

The 625-pin FCBGA package provides access to a comprehensive set of high-speed serial and parallel interfaces including Serial RapidIO 2.1 (4 lanes at up to 5 GBaud), PCI Express Gen2, HyperLink for inter-device scaling, Gigabit Ethernet, and a 32-bit DDR3-1333 memory controller supporting up to 4GB of external memory.

The TMS320C6657 DSP operates on TI’s KeyStone multicore architecture, which integrates the following key subsystems:

1. DSP Core Subsystem (CorePac): Each of the two C66x cores includes 32KB L1 program memory (configurable as cache/SRAM), 32KB L1 data memory, and 1024KB L2 unified memory. The C66x core executes 8 single-precision floating-point MAC operations per cycle, supporting both fixed-point and IEEE 754-compliant floating-point arithmetic.

2. Multicore Shared Memory Controller (MSMC): The 1024KB MSM SRAM is shared between both DSP cores and can be configured as shared L2 or L3 memory. The MSMC also includes a memory protection unit for both shared memory and the DDR3 EMIF.

3. Multicore Navigator: This central DMA engine manages 8192 hardware queues and uses packet-based DMA to enable zero-overhead data transfers between cores, memory, and peripherals. Queue Manager handles all queue operations, freeing DSP cores for computation.

4. TeraNet Switch Fabric: A non-blocking 2-Tbps interconnect that provides high-bandwidth, low-latency connections between all masters and slaves in the device, ensuring contention-free internal data movement.

5. Hardware Accelerators: Two Viterbi coprocessors (VCP2) handle convolutional decoding at up to 6.44 Mbps each, while one Turbo decoder coprocessor (TCP3d) supports 3GPP LTE and WiMAX standards.

Group Signal Type Count Description
Power VDD, VSS – Core (1.0V), IO (1.5V/1.8V), DDR (1.5V) supplies
Memory DDR3 32 data + 14 addr 32-bit DDR3-1333 interface with ECC support
Memory EMIF16 16 data + addr 16-bit asynchronous external memory interface
High-Speed SRIO 4 lanes Serial RapidIO v2.1, up to 5 GBaud/lane
High-Speed PCIe 2 lanes PCI Express Gen2, single port
High-Speed HyperLink 4 lanes Inter-device connection, up to 40 Gbaud
Networking SGMII 1 port Gigabit Ethernet SGMII interface
Serial UART 2 Universal asynchronous receiver-transmitters
Serial McBSP 2 Multichannel buffered serial ports
Serial I2C 1 Inter-integrated circuit interface
Serial SPI 1 Serial peripheral interface
Parallel uPP 2 ch Universal parallel port (8/16-bit)
GPIO GPIO 32 General-purpose I/O pins
Debug JTAG – IEEE 1149.1 JTAG test interface
Timing Timer 8 64-bit general-purpose timers

Note: Complete pin assignment is available in the device datasheet (Section 4). The 625-pin BGA is organized in a 25×25 matrix with power/ground rings.

  • Power Protection Systems: Digital relay and protection equipment for power transmission and distribution networks, requiring high-performance real-time signal processing for fault detection and classification.
  • Avionics and Defense: Radar signal processing, electronic warfare systems, software-defined radio (SDR), and secure communications requiring floating-point DSP performance and extended temperature operation.
  • Medical Imaging: Ultrasound, MRI, and CT scanner signal processing pipelines where high computational throughput and deterministic real-time performance are critical.
  • Industrial Automation: High-end motion control, machine vision, and factory automation systems requiring precise timing and multi-channel signal processing.
  • Machine Vision & Currency Inspection: High-speed image processing for automated inspection systems, currency authentication, and quality control.
  • Transportation Systems: Railway signaling, traffic management, and automotive ADAS systems requiring robust operation over wide temperature ranges.
Manufacturer Part Number Cores Freq Notes
Texas Instruments TMS320C6655CZHA 1 1.25GHz Single-core variant, same package
Texas Instruments TMS320C6657GZHA 2 1.25GHz Extended temperature, Pb-free
Texas Instruments TMS320C6678ACYPA 8 1.25GHz Octa-core, higher performance
Analog Devices ADSP-TS201SABPZ060 1 600MHz TigerSHARC, alternative DSP
NXP MPC8641D 2 1.5GHz Dual-core PowerQUICC, alternative SoC
Texas Instruments TMS320C6670ACYP2 4 1.2GHz Quad-core with baseband accelerators
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Quality Assurance

Quality is the core foundation of our long-term global cooperation. With over 20 years of experience in the electronic component industry, Materialparts has built a strict and standardized quality management system covering component sourcing, incoming inspection, full-batch testing, packaging and delivery. We are committed to delivering 100% genuine, high-reliability electronic components for industrial control, automotive electronics, consumer electronics and medical device industries, and fully safeguarding your production and R&D projects.

1. Authorized & Genuine Sourcing Promise

All of our electronic components are procured from official authorized distributors and original manufacturers. We strictly reject counterfeits, refurbished parts, disassembled components and gray-market goods. Every product is guaranteed to be brand-new original parts and fully consistent with the original technical parameters. For branded products such as NXP IC series, we maintain complete supply channel documents to realize full product traceability.

2. Strict Full-batch Quality Inspection

We implement 100% full-batch quality control for all goods before shipment. Our professional QC team conducts multi-dimensional tests including appearance inspection, electrical parameter testing, performance verification and packaging check. Each batch of components is attached with complete inspection reports and batch records. We stick to zero-tolerance standards for defective products to ensure every piece of component meets industrial application requirements.

3. Industry Standard Compliance

Our products comply with a variety of international industry quality standards to adapt to high-standard application scenarios:
  • Automotive Electronics: All automotive-grade components pass AEC-Q series certification, featuring excellent stability and durability to adapt to complex vehicle operating environments.
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4. Professional Reliability Control

For static-sensitive, moisture-sensitive and precision components such as ICs, PCBs, sensors and connectors, we carry out reliability screening in advance. Combined with standardized ESD anti-static packaging and vacuum moisture-proof packaging, we avoid component damage caused by static electricity, dampness or collision during storage and transportation, and retain the original performance of products.

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If any product is confirmed to have non-conformity quality problems due to our reasons after receipt, we provide free return, exchange and supplementary delivery services. Our professional quality team will also conduct root cause analysis to optimize our quality control process. We respond to quality feedback within 24 hours to resolve your worries efficiently.

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If you have inquiries about our quality standards, inspection procedures or product certification documents, please feel free to contact us:

 

Email: info@ic-vendor.com
Tel / WhatsApp: +86 13760382860
Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong, China

 

Shipping & Payment

Materialparts is a professional global supplier of electronic components with over 20 years of industry experience. We provide one-stop supply of passive components, integrated circuits, as well as parts for industrial control, automotive electronics, consumer electronics and medical devices. Below are the unified shipping and payment policies applicable to all orders, samples and bulk purchases worldwide.

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    We support flexible minimum order quantities for samples, small-batch and large-batch orders. All sample orders shall comply with the above shipping and payment policies.

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Contact Information

Email: info@ic-vendor.com

Tel / WhatsApp: +86 13760382860

Service & Packaging

Materialparts is a professional electronic component supplier based in Shenzhen, China, with over 20 years of global trading experience. We integrate component procurement, quality inspection, technical support, customized packaging, and global delivery services to provide one-stop supply chain solutions. Our business covers industrial control, automotive electronics, consumer electronics, medical devices and other industries. We always adhere to genuine sources, stable supply and considerate after-sales service.

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We specialize in a full range of passive and active electronic components, including SMD resistors, power resistors, connectors, aviation connectors, LED beads, flexible circuit boards, printed circuit boards, and integrated circuits. Our professional team provides BOM list consolidation, component matching, and alternative model recommendation services. We support sample orders, small-batch trial production, and mass production orders with flexible MOQs to meet diverse procurement needs.

2. Genuine Product Guarantee & Full-process Quality Inspection

All products are sourced from official authorized channels and are 100% original genuine parts. Every batch of goods undergoes strict full-process quality inspection before delivery, with complete batch records and traceability documents provided. Our products comply with AEC-Q standards for automotive electronics and high-reliability specifications for medical devices. We eliminate counterfeits, refurbished parts and defective products from the source to secure your project production.

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Professional Packaging Standards

Electronic components are sensitive to static electricity, collision, moisture and dust. We adopt industry-standard anti-static packaging solutions to fully ensure the integrity of goods during transportation and storage.

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  • Discrete Device Packaging: Discrete devices such as SMD resistors, power resistors and LEDs are quantitatively and classifiedly packaged with accurate quantity and clear marking.
  • Connector / Aviation Connector Packaging: Hard outer packaging is adopted to prevent pin bending and structural deformation.

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We provide value-added services including personalized packaging, custom labeling and re-reeling according to customer requirements, fully matching your production and warehouse management standards.

Contact Information

For service consultation or packaging customization, please feel free to contact us:
Email: info@ic-vendor.com
Tel / WhatsApp: +86 13760382860
Address: Room 2919, Guoli Building, Huaqiang North, Futian District, Shenzhen, Guangdong, China
 

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